This role pays less than
60%
of similar roles. Most pay
$175,000–$231,725
— the shaded band above.
At the midpoint, this role pays about
$187k
versus about
$203k
for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
119 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 105 roles with salary data.
As an ASIC Package Design Manager, you will lead a worldwide R&D team of engineers designing complex flip-chip-BGA packages for high-performance ASICs. You will manage over twenty concurrent designs by tracking project plans, resources, and schedules while developing technical methodologies and steering package technology and design rules. The role involves managing team members to maximize productivity, collaborating with vendors and cross-functional partners, and overseeing the full package-design lifecycle. You will address technical challenges involving high-speed SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, and DDR5. Key competencies include expertise in signal integrity, power integrity, and DFx trade-offs for manufacturability and reliability. Your work focuses on the integration of substrate and package designs into manufacturing flows for artificial intelligence, networking, high-performance computing, and 5G base stations.