ASIC Package Design Manager

Broadcom

Confirmed live today Low trust

Quick summary

Work type: On-site
Location: Fort Collins, CO
Employment: Full-time
Posted: 97 days ago
Freshness: Confirmed live today
Closes: Jan 18, 2027
Nearby: 99+ roles within 25 mi

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Salary context

How this pay compares to similar roles

Similar $201k

$143k $256k

below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $173,906–$228,375.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · ASIC Package Design Manager

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The ASIC Package Design Manager leads a worldwide R&D team of engineers designing complex flip-chip-BGA packages for high-performance ASICs. The role involves managing over twenty concurrent designs, developing technical methodologies, and steering package technology and design rules. Key responsibilities include project management, team development, and collaborating with vendors and cross-functional partners. The position requires expertise in package-level signal integrity, power integrity, and mechanical and thermal modeling. Candidates must understand the package-design lifecycle, including substrate and package integration into manufacturing flows. Technical skills include layout, SI/PI extractions and simulations, automation code development, and handling design data like .mcm files and drawings. This work addresses high-speed SerDes at 448G and higher, 5G RF/Microwave ADC/DAC, HBM, and DDR5 for AI, networking, and high-performance computing.

Skills

Flip-chip-BGA ASIC SerDes HBM DDR5 Signal Integrity Power Integrity Layout DFx Thermal Modeling Automation Project Management Simulation RF Microwave

What you'll do

Create and track project plans for over 20 concurrent flip-chip-BGA designs.
Manage team productivity, skill sets, and retention to meet project goals.
Develop and implement technical methodologies for complex package designs.
Steer package technology and design rules based on team input.
Communicate project plans, status updates, and risks to stakeholders.
Organize team and customer activities to ensure projects remain on schedule.
Oversee package-level signal integrity and power integrity for high-speed SerDes.
Manage new business quotes and coordinate with external vendors.

What we're looking for

BSEE/MSEE or similar degree in a related field.
12+ years of experience in flip-chip-BGA package design, including high-speed SerDes.
Minimum of 3 years of experience in management.
Knowledge of package-level signal integrity and power integrity.
Technical understanding of package-design lifecycle, substrate/package manufacturing flows, and design data.
Technical understanding of DFx trade-offs, layout, SI/PI extractions, simulations, and mechanical/thermal modeling.
Experience managing people and projects (preferred).
Ability to work on-site at the Broadcom office 5 days a week.

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