Analog/Mixed-Signal IP Engineering Program Manager

Apple Inc

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Quick summary

Work type
On-site
Location
Cupertino, CA
Salary
$175,500–$311,700 / yr
Posted
58 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $200k
This role $244k
$133k most similar roles pay here $331k

This role pays more than 88% of similar roles. Most pay $168,500–$231,300 — the shaded band above. At the midpoint, this role pays about $244k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Analog/Mixed-Signal IP Engineering Program Manager

The Analog/Mixed-Signal IP Engineering Program Manager leads the end-to-end development of high-speed AMS IPs, including Data Converters, PLLs, and SerDes, within the silicon organization. This role manages the program lifecycle from early concept through mass production for a System-on-Chip portfolio. The manager serves as the central hub connecting cross-functional teams in IC Design, SoC PD, DV, CAD, Software, Hardware, and Legal to ensure technical gates are met on schedule. Key responsibilities include defining test structure requirements, managing global engineering efforts across time zones, and collaborating with foundries to co-develop proprietary hardware solutions. The role requires expertise in advanced packaging technologies, cutting-edge silicon nodes, and EDA tools. Candidates should possess experience with SerDes, LPDDR, HBM, PLLs, or LDOs, as well as knowledge of Optical technologies, uLED, Silicon Photonics, and uVCSEL applications.

What you'll do

  • Manage the end-to-end lifecycle of high-speed Analog and Mixed-Signal IP from concept through mass production.
  • Drive silicon and packaging execution for complex SoC designs to ensure alignment with tape-out schedules.
  • Partner with foundational vendors and foundries to co-develop proprietary hardware solutions for next-generation products.
  • Define requirements for advanced test structures and implement robust testing methodologies across the SoC portfolio.
  • Act as a central hub connecting IC Design, CAD, Software, Hardware, and Legal teams to meet technical gates.
  • Synchronize global engineering efforts and manage deliverables across multiple international time zones.
  • Identify project risks and develop mitigation strategies to maintain execution velocity in evolving environments.

What we're looking for

  • BS in Electrical Engineering or Electrical and Computer Engineering.
  • 10+ years of relevant experience.
  • Proven track record in AMS IP design or design engineering management in the AMS space.
  • Experience with high-speed AMS IPs including Data Converters, PLLs, and SerDes.
  • Expertise in advanced packaging technologies and cutting-edge silicon nodes.
  • Proficiency in EDA tools, IP development methodologies, and SoC integration.
  • Ability to manage global programs and coordinate across cross-functional teams like IC Design, CAD, and Legal.
  • Experience with Optical technologies, uLED, Silicon Photonics, or uVCSEL is a plus.

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