Analog/Mixed-Signal IP Engineering Program Manager

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $166,600–$296,000 / yr
Posted: 58 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $200k

This role $231k

$135k most similar roles pay here $313k

This role pays more than 76% of similar roles. Most pay $168,500–$231,300 — the shaded band above. At the midpoint, this role pays about $231k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Analog/Mixed-Signal IP Engineering Program Manager

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As an Analog/Mixed-Signal IP Engineering Program Manager, you will lead the end-to-end development of high-speed AMS IPs, including Data Converters, PLLs, and SerDes, within the silicon organization. You will manage the program lifecycle from early concept through mass production for a System-on-Chip portfolio, ensuring all technical gates and schedules are met. The role involves coordinating cross-functional teams across IC Design, SoC PD, DV, CAD, Software, Hardware, and Legal to define test structures and robust testing methodologies. You will navigate complex requirements involving advanced packaging technologies, cutting-edge silicon nodes, and EDA tools. Key domain expertise includes managing IP roadmaps for data center infrastructure and consumer platforms. Preferred experience includes Optical technologies, uLED, Silicon Photonics, and uVCSEL applications. You must translate complex technical information into clear communication to mitigate risks across global engineering teams.

Skills

Analog and Mixed-Signal (AMS) SoC SerDes Data Converters LPDDR HBM LDOs Silicon Photonics uLED uVCSEL EDA Tools IC Design SI/PI Tape-out Advanced Packaging

What you'll do

Manage the end-to-end lifecycle of high-speed Analog and Mixed-Signal IP from concept through mass production.
Drive silicon and packaging execution to ensure all technical gates are met for SoC designs.
Partner with foundries and vendors to co-develop proprietary hardware solutions for next-generation products.
Define requirements for advanced test structures and implement robust testing methodologies across the organization.
Act as the primary liaison between IC Design, CAD, Software, Hardware, and Legal teams.
Synchronize global engineering efforts and manage deliverables across multiple international time zones.
Identify project risks and develop mitigation strategies to meet aggressive hardware milestones.
Adapt schedules and strategies quickly in response to a rapidly evolving technical landscape.

What we're looking for

BS in Electrical Engineering or Electrical and Computer Engineering.
10+ years of relevant experience.
Proven track record in AMS IP design or design engineering management in the AMS space.
Experience with advanced packaging technologies, cutting-edge silicon nodes, and SoC integration.
Expertise in high-speed AMS IPs including Data Converters, PLLs, SerDes, LPDDR, HBM, and LDOs.
Ability to manage program lifecycles from concept through tape-out and mass production.
Experience with advanced EDA tools and IP development methodologies.
Demonstrated ability to lead cross-functional teams and manage stakeholders in a matrixed organization.

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