Analog/Mixed-Signal IP Engineering Program Manager

Apple Inc

Confirmed live yesterday Trusted

Quick summary

Work type: On-site
Location: Austin, TX
Posted: 58 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

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Similar $200k

$141k most similar roles pay here $257k

This listing doesn't post a salary. Most similar roles pay $168,500–$231,300.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Analog/Mixed-Signal IP Engineering Program Manager

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The Analog/Mixed-Signal IP Engineering Program Manager leads the end-to-end development of high-speed AMS IPs, including Data Converters, PLLs, and SerDes, within the silicon organization. This role manages the program lifecycle from early concept through mass production for a System-on-Chip portfolio, ensuring all technical and compliance gates are met on schedule. You will serve as the central hub connecting cross-functional teams in IC Design, SoC PD, DV, CAD, Software, Hardware, and Legal to define test structures and robust testing methodologies. The role requires expertise in advanced packaging technologies, cutting-edge silicon nodes, and EDA tools. Candidates should possess experience with Optical technologies, uLED, Silicon Photonics, and uVCSEL. You will manage global engineering efforts across international time zones while navigating complex risks and technical requirements for both consumer and data center platforms.

Skills

Analog and Mixed-Signal (AMS) IP SoC SerDes Data Converters LPDDR HBM LDOs Silicon Photonics uLED uVCSEL EDA Tools SI/PI Tape-out IC Design Advanced Packaging

What you'll do

Manage the end-to-end lifecycle of high-speed Analog and Mixed-Signal IP programs from concept through mass production.
Drive silicon and packaging execution for complex SoC designs to ensure alignment with tape-out schedules.
Partner with foundational vendors and foundries to co-develop proprietary hardware solutions for next-generation products.
Define requirements for advanced test structures and implement robust testing methodologies across the SoC portfolio.
Act as the central hub connecting IC Design, CAD, Software, Hardware, and Legal teams to meet technical gates.
Synchronize global engineering efforts and manage deliverables across multiple international time zones.
Identify project risks and develop mitigation strategies to maintain execution velocity in a rapidly evolving landscape.

What we're looking for

Bachelor of Science in Electrical Engineering or Electrical and Computer Engineering.
10+ years of relevant experience in the field.
Proven track record in AMS IP design or design engineering management within the AMS space.
Experience with high-speed AMS IPs including Data Converters, PLLs, and SerDes across multiple technology nodes.
Expertise in advanced packaging technologies and SoC integration for consumer and data center platforms.
Ability to manage complex program lifecycles from initial concept through mass production and tape-out.
Demonstrated ability to lead cross-functional teams and influence stakeholders in a large, matrixed organization.
Proficiency in risk management and navigating high-complexity programs with executive accountability.

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