Technical Director, Key Logic Account

Applied Materials

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Quick summary

Work type
On-site
Location
Hillsboro, OR
Salary
$176,000–$242,000 / yr
Employment
Full-time
Posted
83 days ago
Freshness
Confirmed live today

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $219k
This role $209k
$156k $276k
below market most similar roles pay here above market

This role pays less than 58% of similar roles. Most pay $182,937–$255,306 — the blue band above. At the midpoint, this role pays about $209k versus about $219k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · Technical Director, Key Logic Account

The Technical Director, Key Logic Account serves as a senior technical leader within the Global Field Group. This senior individual-contributor role involves leading account-wide strategic initiatives to improve device yield, performance, and cost for a major logic account. The position requires building multi-product technology programs that bundle benefits across deposition, etch, anneal, and metrology process areas. You will interface with customers at development and high-volume-manufacturing sites to identify technology inflections and shape internal product roadmaps. Key responsibilities include managing timelines, risks, and deliverables while mentoring engineers and providing technical authority on integration or unit process issues. Candidates must possess deep expertise in semiconductor process engineering, wafer fab process integration, and leading logic technologies to solve complex manufacturing problems within the semiconductor capital equipment industry.

What you'll do

  • Lead account-wide strategic initiatives to improve device yield, performance, and cost across multiple product areas.
  • Interface with customers at development and manufacturing sites to evaluate and adopt new emerging technologies.
  • Identify technology inflections through customer engagement to shape internal product roadmaps and development priorities.
  • Align internal commercial, technical, and operations groups to drive consensus and outcomes for key initiatives.
  • Own timelines, milestones, risk management, and deliverables for strategic initiatives and Continuous Improvement Programs.
  • Serve as the senior technical authority to support internal teams on deep integration or unit process issues.
  • Mentor engineers and foster a collaborative, high-performance environment across cross-functional teams.

What we're looking for

  • B.S. in an engineering discipline, or M.S. in Physics, Chemistry, or an equivalent STEM field.
  • Advanced degree (M.S. or Ph.D.) (preferred).
  • 12+ years of experience in the wafer fab or semiconductor capital equipment industry.
  • 15+ years preferred in semiconductor capital equipment process engineering, wafer fab process engineering, or wafer fab process integration within a technology development organization.
  • Demonstrated experience leading complex, cross-functional technical programs and influencing outcomes across engineering, commercial, and operations teams.
  • Proven experience partnering with customers at development and high-volume-manufacturing sites, including presenting to and building trust with senior technical and executive stakeholders.
  • In-depth technical expertise in semiconductor process technology (deposition, etch, anneal, or metrology) or process integration of leading logic or advanced packaging process flows.
  • Advanced packaging experience (preferred).

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