Director Pathfinding Solutions

Applied Materials

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Quick summary

Work type
On-site
Location
Albany, NY
Salary
$176,000–$242,000 / yr
Employment
Full-time
Posted
68 days ago
Freshness
Confirmed live today

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $240k
This role $209k
$163k $301k
below market most similar roles pay here above market

This role pays less than 72% of similar roles. Most pay $207,679–$272,131 — the blue band above. At the midpoint, this role pays about $209k versus about $240k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 337 open roles on FindRole.

Listed pay typically runs $124,000–$171,000 across 219 roles with salary data.

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At a glance

TL;DR · Director Pathfinding Solutions

JOB TITLE: Director Pathfinding Solutions - Integrated Materials Solutions The Director Pathfinding Solutions serves as a technically distinguished individual contributor and deep technical leader within the Integrated Materials Solutions team. This role focuses on developing next-generation semiconductor process solutions for logic and memory device architectures, specifically targeting N+1 and N+2 technology nodes. Responsibilities include hands-on process development across deposition, etch, implant, epitaxy, CMP, and thermal processing to create integrated module flows. The position requires performing Design-Technology Co-Optimization (DTCO) analysis to solve integration problems like contact resistance reduction and carrier mobility enhancement. Key skills include expertise in device physics, materials science, and FEOL, MOL, or BEOL technologies. The role involves collaborating across product business units, engaging with senior customer technologists, and publishing technical leadership in journals and at premier conferences like IEDM and VLSI.

What you'll do

  • Develop and demonstrate integrated pathfinding process solutions for advanced logic and memory device architectures.
  • Drive hands-on process development across deposition, etch, implant, epitaxy, CMP, and thermal processing.
  • Identify and de-risk critical process challenges for N+1 and N+2 technology nodes using DTCO analysis.
  • Translate customer device performance targets into actionable process solutions and development programs.
  • Coordinate wafer flows, DOE designs, and data analysis across multiple business units and process modules.
  • Engage directly with senior technologists at major semiconductor customers to align on pathfinding priorities.
  • Publish technical research at premier conferences and build a patent portfolio in advanced process integration.
  • Influence product roadmaps by providing deep technical insights and pathfinding learnings to internal teams.

What we're looking for

  • Ph.D. in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related semiconductor discipline.
  • 10+ years of experience in semiconductor process development, integration, or device engineering with deep expertise in FEOL, MOL, or BEOL.
  • Demonstrated hands-on track record of developing integrated process solutions for advanced logic and/or memory nodes.
  • Strong publication record at top-tier semiconductor conferences and/or a significant patent portfolio.
  • Experience engaging directly with customer technical teams at major semiconductor manufacturers.
  • Deep understanding of device physics, process-structure-property relationships, and DTCO principles.
  • Exceptional analytical, problem-solving, and communication skills.
  • Experience collaborating with a semiconductor equipment or materials company (preferred).

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