below marketmost similar roles pay hereabove market
This role pays less than
73%
of similar roles. Most pay
$208,300–$262,462
— the blue band above.
At the midpoint, this role pays about
$209k
versus about
$235k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
337 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 219 roles with salary data.
The Panel Packaging Technology Enablement Director leads a multidisciplinary team of process, integration, and applications engineers to develop and validate panel process solutions. This role involves defining the technology enablement roadmap, translating AI package architecture requirements into unit process targets, and managing complex integration programs from concept through customer transfer. Key responsibilities include planning integrated process flows for core formation, through-glass via fabrication, metallization, and fine-line RDL. The position requires expertise in 2.5D/3D packaging, PVD, plating, etch, lithography, and dielectric processes. The Director serves as a technical lead for substrate manufacturers, OSATs, and foundries, addressing high-value problems in panel-level packaging for AI accelerators and high-performance computing. Success requires managing joint development programs, establishing industry standards, and driving cross-functional coordination to deliver integrated packaging solutions.
Semiconductor Manufacturing
Process Integration
Deposition
Etch
CMP
Metrology
Inspection
Patterning
DRAM
High-Volume Manufacturing
R&D
Defectivity
Process Support Engineering
Materials Science