Process Integration Engineer III

Applied Materials

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Albany, NYSanta Clara, CA
Salary
$108,000–$148,500 / yr
Employment
Full-time
Posted
5 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $176k
This role $128k
$95k most similar roles pay here $227k

This role pays less than 81% of similar roles. Most pay $139,000–$214,000 — the shaded band above. At the midpoint, this role pays about $128k versus about $176k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 179 open roles on FindRole.

Listed pay typically runs $131,000–$180,000 across 143 roles with salary data.

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View all roles at Applied Materials

At a glance

TL;DR · Process Integration Engineer III

As a Process Integration Engineer III, you will join the CTO group to develop advanced packaging solutions for emerging markets and quantum information technologies. You will create process, module, and device integration solutions for photonic platforms and quantum structures while collaborating with hardware, metrology, and process teams to develop new materials and structures. Your daily responsibilities include designing and conducting experiments, performing root cause analysis to troubleshoot complex engineering issues, measuring film properties, and generating technical documentation for internal and external stakeholders. You will utilize your expertise in semiconductor manufacturing, 3D integration, and advanced optics to solve problems related to quantum devices with lower error rates. The role requires proficiency in data collection and analysis, as well as the ability to interpret results from complex experiments within a high-tech research and development environment.

What you'll do

  • Create process, module, and device integration solutions for photonic platforms and quantum structures.
  • Develop 3D integration and packaging solutions for various platforms and quantum structures.
  • Design and conduct experiments to measure material properties and interpret resulting data.
  • Perform Root Cause Analysis to troubleshoot and resolve complex process engineering issues.
  • Generate technical documentation, reports, and presentations for internal and external stakeholders.
  • Collaborate with customers, startups, and universities to identify problems and develop enabling solutions.
  • Monitor industry advancements in 3D integration and quantum information to implement new technologies.

What we're looking for

  • Bachelor's degree in a related field.
  • 4 to 7 years of experience.
  • Strong semiconductor and 3D integration background.
  • Experience developing advanced packaging solutions for emerging markets and quantum information.
  • Ability to perform Root Cause Analysis and troubleshoot complex process engineering issues.
  • Ability to design, conduct experiments, measure material properties, and interpret data.
  • Proficiency in creating technical documentation, reports, and presentations.
  • Ability to collaborate with customers, startups, or universities to develop solutions.

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