Senior Module Engineer, Hybrid Bonding

What you'll do

• Develop and optimize die-to-wafer hybrid bonding processes for advanced packaging applications like memory and AI accelerators.
• Establish process windows for surface preparation, plasma activation, die placement, and bonding temperature/pressure optimization.
• Identify root causes of bond voids, die shifts, and contamination using DOE methodologies and statistical process control.
• Characterize bonding quality using metrology tools such as CSAM, X-ray, FIB/SEM, and electrical test structures.
• Collaborate with equipment engineering teams to evaluate and qualify next-generation bonding platforms and modules.
• Execute reliability test plans including thermal cycling, mechanical testing, and failure analysis to drive corrective actions.
• Lead cross-functional projects from initial concept through technology transfer and manufacturing scale-up.
• Create technical documentation and present development progress to internal leadership and customers.

What we're looking for

• Must have an M.S. or Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing.
• Must have at least 5 years of semiconductor process development experience after obtaining a graduate degree.
• Must have direct experience in hybrid bonding, thermocompression bonding, wafer bonding, advanced packaging, HBM development, Cu interconnect technology, or chiplet integration.
• Must possess a strong understanding of Cu-Cu interconnect formation, surface chemistry, plasma activation, CMP, and defect engineering.
• Must be proficient in statistical process analysis using DOE and JMP/Minitab tools.
• Must have familiarity with metrology and failure analysis techniques.
• Ph.D. with 5+ years of industry experience (preferred).
• Experience in HBM or 3D stacking, hybrid bonding equipment development, or 200 mm and 300 mm wafer manufacturing environments (preferred).