below marketmost similar roles pay hereabove market
This role pays less than
53%
of similar roles. Most pay
$148,250–$216,250
— the blue band above.
At the midpoint, this role pays about
$175k
versus about
$182k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
365 open roles
on FindRole.
Listed pay typically runs
$126,000–$173,500
across 222 roles with salary data.
The Sr. Module Engineer, Hybrid Bonding joins the team to develop and scale next-generation die-to-wafer hybrid bonding technologies for advanced semiconductor packaging. This role involves leading process module development across die preparation, surface activation, die placement, and bonding temperature optimization. You will drive copper-copper and dielectric-dielectric interconnect formation while identifying root causes for bond voids and overlay errors. Key responsibilities include performing hardware characterization using CSAM X-ray, FIB/SEM, and AFM, and utilizing DOE methodologies with JMP or Minitab for statistical process control. You will collaborate with equipment engineering teams to qualify bonding platforms for memory architectures, chiplets, and AI accelerators. The work focuses on solving technical challenges in 3D integration and HBM stacking to enable high-bandwidth, energy-efficient computing systems through advanced interconnect technologies.
Develop and optimize die-to-wafer hybrid bonding processes for advanced semiconductor packaging applications.
Establish process windows for surface preparation, plasma activation, die placement, and bonding temperature/pressure.
Identify root causes of bond voids, die shift, and overlay errors using DOE and statistical process control.
Drive bonding quality characterization using CSAM X-ray, FIB/SEM, AFM, and optical metrology.
Collaborate with equipment engineering teams to evaluate and qualify next-generation bonding platforms.
Execute reliability test plans including thermal cycling, HTOL, and mechanical pull/shear testing.
Lead cross-functional projects from initial concept through technology transfer to manufacturing.
Present development progress and technical results to engineering leadership and customers.
What we're looking for
M.S. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing.
Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or Semiconductor Manufacturing.
Minimum 5+ years of semiconductor process development experience after graduate degree.
Direct experience in at least one of: Hybrid bonding, Thermocompression bonding, Wafer bonding, Advanced packaging, HBM development, Cu interconnect technology, or Chiplet integration.
Strong understanding of Cu-Cu interconnect formation, surface chemistry, plasma activation, CMP, planarization, defect engineering, and semiconductor process integration.
Experience with DOE and JMP/Minitab analysis tools.
Familiarity with metrology and failure analysis techniques.
Ph.D. with 5+ years industry experience (preferred).
Semiconductor Manufacturing
Deposition
Etch
Epitaxy (EPI)
PVD
Design of Experiments (DOE)
JMP
Minitab
Statistical Process Control
Process Characterization
Root-Cause Analysis
Data Analytics
Thin Films
Diffusion
Process Integration