below marketmost similar roles pay hereabove market
This role pays more than
91%
of similar roles. Most pay
$204,156–$282,150
— the blue band above.
At the midpoint, this role pays about
$336k
versus about
$243k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
505 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 505 roles with salary data.
The Sr. Director of Packaging Engineering will lead the strategy, development, and execution of advanced IC packaging technologies across a diverse silicon product portfolio. This leader will manage a global team to guide package development from concept through high-volume manufacturing, ensuring performance, reliability, and cost optimization. Key responsibilities include owning end-to-end packaging development, directing signal integrity and power integrity co-design, and managing thermal and mechanical package design strategies. The role requires expertise in technologies such as WLCSP, flip-chip, multi-chip module, system-in-package, and 2.5D/3D integration. Candidates must utilize skills in interconnect modeling, PDN design, and thermal simulation to solve complex problems in heterogeneous integration, chiplet-based architectures, and high-speed optoelectronic packaging for multi-die, networking, and accelerator products.
Lead the strategy, development, and execution of advanced IC packaging technologies across the silicon product portfolio.
Own end-to-end packaging development from initial concept through new product introduction and high-volume manufacturing.
Direct package-level signal integrity and power integrity co-design for multi-die and chiplet architectures.
Manage thermal and mechanical package design strategies, including simulation, warpage control, and stress management.
Manage strategic relationships with OSAT, substrate, and PWB supply partners for technology development and capacity planning.
Lead and mentor a global team of engineers to build organizational depth in specialized design expertise.
Drive technology standardization and innovation in heterogeneous integration and chiplet-based architectures.
Establish and monitor engineering budgets, headcount planning, and program schedules for the packaging organization.
What we're looking for
Bachelor's degree in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or a related technical discipline.
Master's degree or PhD (preferred).
Significant and progressive experience in semiconductor IC packaging engineering with a track record of advancing into director-level technical leadership (preferred).
Direct experience developing and qualifying packaging solutions for complex digital, mixed-signal, RF, or high-speed silicon (preferred).
Deep technical expertise in advanced packaging technologies like WLCSP, flip-chip, multi-chip module, SiP, 2.5D/3D integration, or chiplet interconnect (preferred).
Expertise in package-level signal integrity, power integrity, and thermal/mechanical package design (preferred).
Proven experience managing OSAT, substrate, and PWB supplier partnerships (preferred).
Experience leading global engineering teams and excellent cross-functional leadership and communication skills (preferred).