Senior Manager Packaging Engineering

What you'll do

• Lead end-to-end execution of multiple Data Center GPU and MI package design programs.
• Manage schedule, quality, and cost targets while overseeing risk management and milestone tracking.
• Lead, mentor, and develop a high-performing team of package design engineers across different geographies.
• Coordinate with silicon, SI/PI, thermal, and mechanical teams to ensure design convergence.
• Engage with OSAT and substrate vendors to optimize design feasibility, manufacturability, and yield.
• Define and implement improved design methodologies and workflows to enhance execution efficiency.
• Champion the adoption of AI/ML-enabled tools and automation for layout optimization and predictive analytics.
• Provide regular program status, risks, and mitigation strategies to senior leadership.

What we're looking for

• B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field.
• Experience in semiconductor package design, with a focus on high-performance or data center products (preferred).
• Experience leading teams and executing multiple concurrent complex projects in fast-paced environments (preferred).
• Strong understanding of package layout, high-speed design considerations, and multi-die integration (preferred).
• Experience with AI/ML applications in engineering workflows such as design automation or data analytics (preferred).
• Experience in Data Center GPU, HPC, or advanced packaging technologies like chiplets and 2.5D/3D integration (preferred).
• Hands-on experience with industry tools such as Synopsys 3DICC, Cadence SiP / APD, or equivalent (preferred).
• Experience working with OSATs, substrate vendors, and manufacturing partners (preferred).