Packaging Engineer

What you'll do

• Define package characteristics based on module performance, cost, and footprint requirements.
• Develop package specifications and long-term packaging roadmaps.
• Manage external suppliers for package design, material selection, and process flow development.
• Perform proof of concept builds, process qualifications, and reliability testing.
• Analyze yields and implement enhancements to improve manufacturing performance.
• Drive the transition of products from the conceptual stage to high-volume manufacturing.
• Construct Designs of Experiments to select optimal materials and processes.

What we're looking for

• BS degree and 10+ years of relevant industry experience.
• M.S. or Ph.D. in mechanical engineering, physics, materials science, or similar disciplines with 10+ years of IC packaging experience (preferred).
• Knowledge and hands-on experience with Wafer Bumping and Dielectric materials (preferred).
• Hands-on knowledge of manufacturing assembly processes including back-grind, dicing, Flip Chip die attach, and molding (preferred).
• In-depth knowledge of Wafer Level Chip Scale Packaging, including RDL and BEOL Assembly processes (preferred).
• Expert level knowledge of common reliability failure modes and device physics (preferred).
• Proven track record of bringing products from conceptual stages to high-volume manufacturing (preferred).
• AutoCAD, APD, and multi-physics simulation knowledge (preferred).