Senior IC Packaging Development Engineer

What you'll do

• Lead the development of rapid IC packaging for Failure Analysis and New Product Introduction tasks.
• Drive the process, mechanical, thermal, and material evaluation of the latest IC packages.
• Manage rapid prototyping builds, package stack-ups, and assembly processes from concept to small volume.
• Pioneer new packaging and die-level processing methodologies and evaluate innovative packaging materials.
• Coordinate comprehensive physical and electrical failure analysis on prototype builds to determine root causes.
• Collaborate with foundries and OSAT partners to develop and test required processes, tooling, and workflows.
• Establish advanced packaging processes to meet goals regarding turn-around-time, reliability, and chip-package interaction.

What we're looking for

• B.S., M.S., or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
• 12+ years of hands-on experience in IC packaging development and/or package design and NPI.
• Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
• Basic understanding of advanced packaging related FA techniques and equipment such as SEM, EDX, CSAM, X-Ray, and LIT.
• Experience driving process, mechanical, thermal, and material evaluation of IC packages.
• Experience managing rapid prototyping builds, package stack-ups, and assembly processes.
• Experience coordinating physical and electrical failure analysis on prototype builds and reliability-tested components.
• Familiarity with IC package EDA software and Finite Element Modeling tools like ANSYS or ABAQUS (preferred).