below marketmost similar roles pay hereabove market
This role pays less than
94%
of similar roles. Most pay
$163,000–$219,000
— the blue band above.
At the midpoint, this role pays about
$125k
versus about
$191k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
496 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 496 roles with salary data.
The Packaging Design Engineer joins the team to support complex package design execution for advanced products. This role requires a self-driven technical expert to perform end-to-end package design, ensuring performance, cost, and quality targets are met. Key responsibilities include developing substrate layouts, bump maps, and interposer designs for 2.5D, 3D, and chiplet-based architectures. The engineer will drive design decisions by collaborating with SI/PI, mechanical, and SOC teams while interfacing with OSATs and substrate vendors. The position utilizes AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration. Required skills include experience with EDA tools, Signal Integrity, and Power Integrity fundamentals. The role focuses on improving layout efficiency, design standardization, and methodology flows for complex silicon physical designs.