Senior Director, AI Technology & Manufacturing

Qualcomm

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$251,700–$377,500 / yr
Posted
20 days ago
Freshness
Confirmed live today
Closes
Apr 5, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $248k
This role $315k
$168k $400k
below market most similar roles pay here above market

This role pays more than 87% of similar roles. Most pay $207,000–$288,650 — the blue band above. At the midpoint, this role pays about $315k versus about $248k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Senior Director, AI Technology & Manufacturing

The Sr. Director, AI Technology & Manufacturing joins the Global Manufacturing Technology and Operations team to lead the expansion of manufacturing capabilities and technology roadmaps. This leader will integrate distributed efforts across system-technology co-optimization, test, and supplier enablement into a unified roadmap covering silicon, packaging, substrates, memory, power, and thermal management. Key responsibilities include securing advanced-node wafer and memory capacity, driving qualification for datacenter technologies like QCM/HBM and EMIB, and establishing server-class burn-in and thermal strategies. The role requires deep semiconductor expertise to manage relationships across foundry, OSAT, and memory supplier ecosystems. The position solves complex manufacturing and supply assurance problems for Datacenter, Automotive, and Physical AI business units by translating long-range requirements into actionable technology, capacity, and capability plans.

What you'll do

  • Lead the datacenter and module technology and manufacturing agenda across test, packaging, memory, and thermal systems.
  • Develop and own an integrated STCO roadmap spanning silicon, package, power, and thermal for 3-4 year product plans.
  • Translate long-range business unit requirements into actionable technology, manufacturing, capacity, and capability plans.
  • Secure required capacity across advanced-node wafers, substrates, OSAT/CM, and memory through multi-year supplier agreements.
  • Lead the stand-up and scaling of datacenter test capabilities and hardware engineering deployment across multiple sites.
  • Establish strategies for burn-in, system-level test, and thermal management for server-class products.
  • Create clear operating interfaces and decision-making mechanisms across technology roadmaps, technical qualifications, and supplier selection.
  • Build a joint planning cadence with business units to connect near-term execution with long-term product requirements.

What we're looking for

  • Bachelor's degree in a related field and 10+ years of hardware engineering experience.
  • Master's degree in a related field and 9+ years of hardware engineering experience.
  • PhD in a related field and 8+ years of hardware engineering experience.
  • 8+ years of leadership experience in the data center industry, semiconductor development, and manufacturing, including Director-level leadership (preferred).
  • Demonstrated experience delivering complex server-class systems from concept through volume production (preferred).
  • Established relationships across foundry, OSAT, substrate, and memory suppliers with experience in multi-year capacity negotiations (preferred).
  • Technical expertise in burn-in, system-level test, thermal management, advanced packaging, and server-class manufacturing (preferred).
  • Knowledge of datacenter customer requirements and rack-scale infrastructure (preferred).

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