Signal & Power Integrity Hardware ASIC Simulation Engineer

Cisco

Confirmed live yesterday Low trust
Closes in 3 days Hybrid

Quick summary

Work type
Hybrid
Location
San Jose, CA
Employment
Full-time
Posted
96 days ago
Freshness
Confirmed live yesterday
Closes
Oct 30, 2026 (soon)

Market check

Salary context

How this pay compares to similar roles

Similar $189k
$139k $235k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $162,000–$216,250.

Based on 240 similar postings.

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About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 307 open roles on FindRole.

Listed pay typically runs $167,700–$245,000 across 224 roles with salary data.

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At a glance

TL;DR · Signal & Power Integrity Hardware ASIC Simulation Engineer

The Signal & Power Integrity Hardware ASIC Simulation Engineer joins the Cisco Silicon One team to develop next-generation ASIC packaging for high-performance networking platforms. This role involves developing and documenting design rules for ultra-high-speed signaling while ensuring power, performance, and area goals are met. The engineer will analyze substrate signal integrity and power integrity, collaborating with layout teams to optimize solutions across interposers, substrates, and PCBs. Key responsibilities include performing post-layout extraction, reporting, and resolving complex technical issues using advanced technology design rules. Required expertise includes Transmission Line Theory, electromagnetics, and 56G PAM4 SerDes architectures. Candidates must be proficient with EDA tools like Cadence Sigrity, Ansys HFSS, and Keysight ADS, while possessing working knowledge of SPICE, Vector Network Analysis, and IBIS for circuit-level analysis and performance validation.

What you'll do

  • Develop, document, and implement design rules for ultra-high-speed signaling to meet power, performance, and area goals.
  • Analyze substrate signal integrity (SI) and power integrity (PI) for interposers, substrates, and PCBs.
  • Design and develop ASIC packages for high-volume, high-quality release.
  • Perform post-layout extraction and reporting for ASIC packaging.
  • Conduct detailed layout reviews and physical design validation to mitigate crosstalk and ensure performance.
  • Execute pre- and post-layout SI/PI simulations using industry-standard EDA tools.
  • Perform circuit-level analysis and signal modeling using SPICE.
  • Resolve complex technical issues by collaborating with system partners, vendors, and design leads.

What we're looking for

  • Must live within commuting distance of the San Jose, CA office and commute 4-5 days per week.
  • Bachelor's in Electrical Engineering with 4+ years of experience, Master's with 2+ years, or PhD with 0+ years of relevant SI/PI experience.
  • Expertise in high-speed design principles including Transmission Line Theory, electromagnetics, and 56G PAM4 SerDes architectures.
  • Proficiency in SI/PI simulations using EDA tools such as Cadence Sigrity, Ansys HFSS, and Keysight ADS.
  • Experience conducting layout reviews and physical design validation using Cadence APD and Ansys EM flows.
  • Working knowledge of SPICE for circuit-level analysis and signal modeling.
  • Skilled in articulating technical concepts to diverse audiences (preferred).
  • Bachelor's degree in Electrical Engineering and 4+ years of relevant signal and power integrity.

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