Signal Integrity Engineer

Broadcom

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$121,900–$195,000 / yr
Posted
28 days ago
Freshness
Confirmed live yesterday
Closes
Jan 9, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $187k
This role $158k
$110k most similar roles pay here $230k

This role pays less than 75% of similar roles. Most pay $158,950–$214,925 — the shaded band above. At the midpoint, this role pays about $158k versus about $187k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 119 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 105 roles with salary data.

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View all roles at Broadcom

At a glance

TL;DR · Signal Integrity Engineer

The Signal Integrity Engineer joins the ASIC Products Division to develop next-generation products with a focus on parallel interfaces in the MCM, 2.5D, and 3D spaces. This role combines aspects of application engineering and research and development to address complex interconnect technologies for artificial intelligence, machine learning, cloud computing, wireless infrastructure, and networking. Daily responsibilities include mask based timing signoff using SPICE simulations, electromagnetic extraction and modeling of signal and power delivery channels across PCBs, packages, and interposers, and AC and transient analysis of Power Distribution Networks. The candidate will perform IO channel analysis, pre-layout modeling of transceivers, and automate sign-off processes. Required skills include proficiency in TCL and Python scripting, experience with DDR/LPDDR or HBM sign-off tool suites, and the ability to manage multiple concurrent customers while navigating various IC, package, and PCB database types.

What you'll do

  • Perform mask-based timing signoff using time domain simulations for 2.5D and 3D parallel interfaces.
  • Conduct electromagnetic extraction and modeling of signal and power delivery channels across PCB, package, and interposers.
  • Execute AC and transient analysis of Power Distribution Networks (PDN).
  • Perform IO channel analysis and pre-layout modeling of transceivers and PDN networks.
  • Automate sign-off processes and collaborate with EDA suppliers to improve tool accuracy and flow.
  • Create technical presentations, sign-off reports, and documentation for internal teams and customers.
  • Support pre-sales activities by providing technical data and analysis results to potential clients.

What we're looking for

  • Bachelor's degree in Electrical/Electronics/Computer Engineering with 8+ years of related experience.
  • Master's degree in Electrical/Electronics/Computer Engineering with 6+ years of related experience.
  • Experience performing mask-based timing signoff using time domain simulations for parallel interfaces, including 2.5D and 3D.
  • Expertise in electromagnetic extraction and modeling of signal and power delivery channels across PCB, Package, and Interposers.
  • Proficiency in AC and transient analysis of Power Distribution Networks (PDN) and IO channel analysis.
  • Knowledge of at least one DDR/LPDDR and/or HBM SI/PI sign-off flow tool suite.
  • Experience with various IC, Package, and PCB database types.
  • Proficiency in TCL or Python scripting to automate routine tasks and sign-off processes.

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