Signal Integrity Engineer

Broadcom

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Employment
Full-time
Posted
65 days ago
Freshness
Confirmed live 2 days ago
Closes
Feb 20, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $193k
$141k $240k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $157,062–$229,100.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 279 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 168 roles with salary data.

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At a glance

TL;DR · Signal Integrity Engineer

The Signal Integrity Engineer joins the ASIC Products Division to develop next-generation products focusing on parallel interfaces within the MCM, 2.5D, and 3D spaces. This role combines application engineering and R&D responsibilities, requiring the candidate to work on customer products and new interconnect technologies. Key duties include mask-based timing signoff using SPICE time domain simulations, electromagnetic extraction for PCB and package channels, and AC and transient analysis of Power Distribution Networks. The engineer will perform IO channel analysis, pre-layout modeling of transceivers, and automate sign-off processes. Required skills include proficiency in DDR/LPDDR and HBM SI/PI signoff tool suites, experience with IC and PCB database types, and TCL or Python scripting. The work addresses complex signal and power delivery challenges in advanced interconnect technologies.

What you'll do

  • Perform mask-based timing signoff using time domain simulations for parallel interfaces in 2.5D and 3D spaces.
  • Extract and model electromagnetic signals for PCB, package, and interposer power delivery channels.
  • Conduct AC and transient analysis of Power Distribution Networks.
  • Perform pre-layout modeling for transceivers, signal networks, and PDN networks.
  • Automate sign-off processes and collaborate with EDA suppliers to improve tool accuracy and analysis flow.
  • Generate analysis results, sign-off reports, and presentations to support pre-sales activities for customers.
  • Execute IO channel analysis for next-generation ASIC products.

What we're looking for

  • Bachelors degree and 12+ years of related experience.
  • Masters degree and 10+ years of related experience.
  • Knowledge of at least one DDR/LPDDR and/or HBM SI/PI sign-off flow tool suite.
  • Experience with various IC, Package, and PCB database types.
  • TCL and Python scripting experience to automate routine tasks.
  • Experience with mask based timing signoff using time domain simulations of parallel interfaces.
  • Experience with electromagnetic extraction and modeling of signal and power delivery channels.
  • Ability to manage multiple concurrent customers under short timelines.

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