below marketmost similar roles pay hereabove market
This role pays more than
62%
of similar roles. Most pay
$183,120–$231,000
— the blue band above.
At the midpoint, this role pays about
$209k
versus about
$207k
for comparable roles.
Based on 240 similar postings.
Employer
About Microsoft
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has
694 open roles
on FindRole.
Listed pay typically runs
$119,800–$234,700
across 651 roles with salary data.
The Principal Product Engineer joins the Silicon Manufacturing and Product Engineering team within the Compute Silicon & Manufacturing Engineering organization. This role focuses on the design, development, manufacturing, and packaging of Microsoft's computer chips, specifically the Azure Cobalt. The engineer manages product and test engineering for new product development, driving pre-Si readiness for power, performance, and thermal tests while overseeing post-Si power and performance tuning. Key responsibilities include implementing ATE test programs, managing manufacturing fuse requirements, and leading cross-functional teams to optimize SOC power and TDP. Required expertise includes semiconductor IC development, fabrication, testing, packaging, DFT, and transistor theory. The role addresses the technical challenge of deploying high-volume, high-quality cloud hardware by managing the end-to-end product lifecycle from initial definition through to final launch.
What does a Product Engineer earn?
Median $197500 from 31 postings across 9 companies.
Drive pre-Si readiness for power, performance, thermal, and power delivery tests for successful bring-up.
Execute power and performance tuning during the post-Si phase in partnership with platform teams.
Implement ATE test programs to optimize SOC power and TDP through correlation work with system engineers.
Manage product manufacturing fuse requirements and end-to-end data flow across various test sockets.
Lead cross-functional teams and external vendors to manage sub-projects within larger development programs.
Perform test method development, bring-up, characterization, debug, and yield analysis for semiconductor ICs.
Define yield recovery for logic, array, and analog components and drive their implementation.
Manage the end-to-end product development flow from initial definition to final launch.
What we're looking for
Must have a Doctorate with 3+ years of experience, a Master's with 6+ years, or a Bachelor's with 8+ years in a related engineering field.
Must be able to pass Microsoft Cloud Background Checks and meet export control regulations including providing proof of citizenship or residency.
Must have experience in semiconductor IC development, manufacturing, fabrication, testing, and packaging.
Must have knowledge of DFT, silicon fabrication processes, product Q&R, and basic transistor theory.
Must have excellent knowledge of ATE test program development, including test method development, bring-up, characterization, debug, and yield analysis.
Must possess strong project leadership skills to manage external vendors and drive cross-functional teams.
8+ years of experience in product development and manufacturing for large-scale or high-performance SoCs/chips (preferred).
8+ years of experience in developing Integrated Circuits from pre-silicon to first silicon bring-up (preferred).