This role pays more than
64%
of similar roles. Most pay
$179,850–$225,500
— the shaded band above.
At the midpoint, this role pays about
$209k
versus about
$203k
for comparable roles.
Based on 240 similar postings.
Employer
About Microsoft
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has
648 open roles
on FindRole.
Listed pay typically runs
$119,800–$234,700
across 615 roles with salary data.
Principal Product Engineer joins the Silicon Manufacturing & Packaging Engineering team to manage product and test engineering for new product development and manufacturing. This role involves driving pre-Si readiness for power, performance, and thermal tests, as well as managing post-Si power and performance tuning in collaboration with platform teams. The engineer will implement ATE test programs to optimize SoC power and TDP, manage manufacturing fuse requirements, and oversee end-to-end data flow across various test sockets. Key technical competencies include semiconductor IC development, fabrication, testing, packaging, DFT, and transistor theory. The role requires expertise in ATE test program development, characterization, debug, and yield analysis to solve challenges in cloud hardware infrastructure. Candidates should possess skills in project leadership, vendor management, and cross-functional team coordination while navigating the complexities of high-performance computing and large-scale silicon production.
What does a Product Engineer earn?
Median $197500 from 35 postings across 8 companies.
Manage product and test engineering for new product development and manufacturing cycles.
Drive pre-silicon readiness for power, performance, thermal, and power delivery features.
Execute post-silicon power and performance tuning in partnership with platform teams.
Implement ATE test programs to optimize SoC power and TDP through correlation work.
Manage manufacturing fuse requirements and end-to-end data flow across various test sockets.
Lead cross-functional teams and manage external vendors to meet development milestones.
Perform characterization, debug, and yield analysis for semiconductor ICs.
Oversee the full product lifecycle from initial definition through to final launch.
What we're looking for
A relevant degree (PhD, Master's, or Bachelor's) in Electrical Engineering, Computer Engineering, Computer Science, or a related field with 3, 6, or 8 years of experience respectively.
Experience in semiconductor IC development, manufacturing, fabrication, testing, and packaging.
Knowledge of ATE test program development, including test method development, bring-up, characterization, debug, and yield analysis.
Knowledge of DFT, silicon fabrication processes, product Q&R, and basic transistor theory.
Ability to pass Microsoft Cloud Background Checks and meet export control regulations regarding citizenship or residency status.
10+ years of experience in product development and manufacturing for high-performance SoCs/chips (preferred).
10+ years of experience in developing Integrated Circuits across pre-silicon, first silicon bring-up, and new product introduction (preferred).
8+ years of experience in product and test engineering specializing in ATE test program development (preferred).
Electro-mechanical Systems
Digital Electronics
Power Electronics
PCB Layout
Altium
Microcontrollers
DSPs
FPGAs
Ethernet
SPI
I2C
UART
CAN
RS-485
USB
SolidWorks
FEA
EMC Testing
Design for Manufacturability