Principal PCB Engineer, Datacenter / High-Speed Systems

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $201,600–$302,400 / yr
Posted: 73 days ago
Freshness: Confirmed live yesterday
Closes: Dec 27, 2026
Nearby: 99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $202k

This role $252k

$132k most similar roles pay here $321k

This role pays more than 84% of similar roles. Most pay $168,425–$235,750 — the shaded band above. At the midpoint, this role pays about $252k versus about $202k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Principal PCB Engineer, Datacenter / High-Speed Systems

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Principal PCB Engineer – Datacenter / High-Speed Systems joins the Packaging Engineering team to drive next-generation datacenter and high-performance computing platforms. This role focuses on advanced PCB technologies, manufacturability optimization, and supplier engagement for both NPI and volume production. The engineer will define design guidelines, stack-ups, and routing strategies for high-layer count boards while developing DFM libraries. Key responsibilities include collaborating with cross-functional teams to optimize performance, engaging with fabricators to validate advanced laminates and low-loss materials, and leading root cause analysis for fabrication issues. Technical requirements include expertise in SI/PI, HDI, mSAP, and various PCB materials like high-Tg and glass core. The role addresses critical challenges in AI infrastructure, server motherboards, and high-power systems, ensuring hardware remains competitive by pioneering advanced via structures and high-density interconnect solutions within the datacenter domain.

Skills

PCB Design SI/PI DFM NPI High-Speed Design HDI mSAP Root Cause Analysis CAPA Advanced Packaging SiP Substrate Engineering Low-loss Materials

What you'll do

Define PCB design guidelines, stack-ups, and routing strategies for high-speed, high-layer count datacenter boards.
Develop and maintain DFM libraries to ensure designs comply with supplier capabilities.
Engage with manufacturers to evaluate material capabilities, advanced laminates, and new fabrication technologies.
Drive multi-source strategies and conduct supplier qualifications for high-volume production.
Support critical NPI builds for AI and compute platforms while troubleshooting fabrication and assembly issues.
Lead root cause analysis and implement corrective actions for yield excursions and reliability failures.
Develop the PCB technology roadmap by pioneering advanced via structures and new materials.
Monitor industry trends and perform competitive benchmarking to align with leading-edge technologies.

What we're looking for

Bachelor's degree in Chemical, Electrical, or Mechanical Engineering with 8+ years of experience; Master's with 7+ years; or PhD with 6+ years.
Experience in high-speed design fundamentals including SI/PI, loss, and impedance control.
Expertise in advanced PCB fabrication processes such as MLB, HDI, mSAP, build-up, and lamination cycles.
Knowledge of PCB materials including low-loss laminates, core/PPG, copper foil, plating chemistry, and surface finishes.
Experience working directly with PCB fabricators and assemblers to drive technology co-development and multi-source strategies.
Proven track record in NPI builds and resolving manufacturing issues like yield excursions and reliability failures.
Familiarity with AI accelerators, server motherboards, high-power boards, and advanced packaging interactions like SiP or substrate systems.
Ability to communicate effectively with cross-functional teams, suppliers, and executive leadership.