Principal PCB Engineer, Datacenter / High-Speed Systems

Qualcomm

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$201,600–$302,400 / yr
Posted
3 days ago
Closes
Dec 27, 2026
Nearby
99+ roles within 25 mi

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $190k
This role $252k
$127k most similar roles pay here $321k

This role pays more than 87% of similar roles. Most pay $161,500–$218,800 — the shaded band above. At the midpoint, this role pays about $252k versus about $190k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 542 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 521 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Principal PCB Engineer, Datacenter / High-Speed Systems

Role Posting Log in to save

Qualcomm Technologies is hiring a senior-level PCB Engineer to lead the development of advanced datacenter and high-performance computing platforms. This role involves hands-on work with high-speed, high-layer count PCB design, ensuring manufacturability through DFM libraries and collaboration with cross-functional teams. The engineer will engage suppliers to validate capabilities for new materials and technologies, support NPI builds, troubleshoot manufacturing issues, and develop a technology roadmap focusing on advanced via structures and innovative materials. Ideal candidates have extensive experience in high-speed system PCB engineering, familiarity with AI accelerators and server motherboards, and the ability to drive supplier co-development and influence executive stakeholders.

Skills

PCB SI/PI HDI mSAP low-loss_laminates Cu_foil Plating_chemistry Surface_Finish MLB build-up lamination_cycles NPI AI_accelerators server_motherboards SiP substrate bridge-based_systems data-driven_decision_making cross-functional_collaboration

What you'll do

  • Define and drive PCB design guidelines for high-speed, high-layer count datacenter boards.
  • Develop DFM libraries to ensure compliance with supplier capabilities.
  • Engage with PCB manufacturers to validate manufacturing capability versus design requirements.
  • Support critical NPI builds and troubleshoot fabrication/assembly issues.
  • Drive the PCB technology roadmap in collaboration with suppliers.
  • Monitor industry trends and perform competitive benchmarking for alignment with leading-edge technologies.

What we're looking for

  • Bachelor's degree in a relevant engineering field with at least 8 years of experience.
  • Hands-on experience with high-speed PCB design guidelines and stack-up strategies.
  • Proven ability to engage with PCB manufacturers for capability validation and multi-source strategy.
  • Strong understanding of advanced PCB fabrication processes and materials.
  • Experience in NPI builds, troubleshooting, and implementing corrective actions.
  • Ability to drive technology roadmaps and pioneer new PCB technologies.
  • Familiarity with AI accelerators and high-power server motherboards.

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