Principal Chipset Project Engineer, Hardware PCB/Platform Systems for Personal Compute

Qualcomm

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$192,600–$289,000 / yr
Posted
17 days ago
Freshness
Confirmed live yesterday
Closes
Feb 21, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $201k
This role $241k
$144k most similar roles pay here $305k

This role pays more than 79% of similar roles. Most pay $172,500–$229,575 — the shaded band above. At the midpoint, this role pays about $241k versus about $201k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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At a glance

TL;DR · Principal Chipset Project Engineer, Hardware PCB/Platform Systems for Personal Compute

The Principal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute joins the Chipset Systems & Architecture team to lead platform and PCB strategy across the entire compute product portfolio. This leadership role involves defining hardware architecture, driving cost-optimized system decisions, and influencing roadmap directions while engaging with vendors, OEMs, and ODMs. The successful candidate will manage trade-offs regarding layer count, stack-up, routing efficiency, and bill of materials to ensure high performance and manufacturability. Key technical competencies include deep knowledge of power delivery networks (PDN), signal integrity (SI), power integrity (PI), and PCB design tools. The role addresses the complex challenge of balancing cost, area, power, and performance for personal compute systems by coordinating with cross-functional teams in packaging, validation, and customer engineering to deliver scalable, competitive hardware solutions across multiple product generations.

What you'll do

  • Lead early PCB architectural trade-off decisions regarding cost, power, performance, and risk implications.
  • Set and manage targets for PCB cost, area, and bill of materials while maintaining high system performance.
  • Drive PCB competitiveness by optimizing layer counts, stack-up designs, and routing efficiency across product generations.
  • Engage with vendors, OEMs, and ODMs to align on manufacturable and cost-effective platform architectures.
  • Establish best practices and execution playbooks for scalable, cost-driven platform and PCB architecture.
  • Influence future chipset and platform roadmaps based on competitive analysis and technical experience.

What we're looking for

  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of systems engineering experience.
  • Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of systems engineering experience.
  • PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of systems engineering experience.
  • 12+ years of experience in hardware platform architecture and PCB design with a focus on the personal computer segment (preferred).
  • Strong understanding of PCB architecture fundamentals, including layer drivers, stack-up trade-offs, routing density, and cost impacts (preferred).
  • Strong knowledge of power delivery networks (PDN), signal integrity (SI), and power integrity (PI) (preferred).
  • Proven track record of making early architectural decisions impacting platform cost, complexity, manufacturability, and scalability (preferred).
  • Ability to lead cross-functional teams and communicate with senior executives, customers, and partners (preferred).

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