Principal Chipset Project Engineer, Thermal/Limits for Personal Computer
Qualcomm
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How this pay compares to similar roles
This role pays more than 79% of similar roles. Most pay $172,500–$229,575 — the shaded band above. At the midpoint, this role pays about $241k versus about $201k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 623 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.
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At a glance
The Principal Chipset Project Engineer – Hardware PCB/Platform Systems for Personal Compute joins the Chipset Systems & Architecture team to lead platform and PCB strategy across the entire compute product portfolio. This leadership role involves defining hardware architecture, driving cost-optimized system decisions, and influencing roadmap directions while engaging with vendors, OEMs, and ODMs. The successful candidate will manage trade-offs regarding layer count, stack-up, routing efficiency, and bill of materials to ensure high performance and manufacturability. Key technical competencies include deep knowledge of power delivery networks (PDN), signal integrity (SI), power integrity (PI), and PCB design tools. The role addresses the complex challenge of balancing cost, area, power, and performance for personal compute systems by coordinating with cross-functional teams in packaging, validation, and customer engineering to deliver scalable, competitive hardware solutions across multiple product generations.
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