below marketmost similar roles pay hereabove market
This role pays more than
52%
of similar roles. Most pay
$181,825–$254,750
— the blue band above.
At the midpoint, this role pays about
$218k
versus about
$218k
for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
280 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 169 roles with salary data.
The Principal Die-to-Die Interconnect Modeling Architect leads a technical team in building and evolving a foundational modeling platform for die-to-die PHY designs. The architect develops comprehensive behavioral and architectural models to predict link behavior, including BER, latency, throughput, and power consumption. Key responsibilities involve performing tradeoff analyses on signaling schemes, modeling transmitter and receiver interactions, and driving algorithm verification of Verilog implementations. The role requires utilizing MATLAB, Python, and SystemC to perform Monte Carlo evaluations and architectural verification with silicon correlation. The architect must apply communication theory to address equalization, timing recovery, and adaptive signal processing. This position solves complex technical problems in high-speed SerDes and short-reach die-to-die communication systems, ensuring robust operation across manufacturing conditions and various process, voltage, and temperature variations.