Digital ASIC Architect

Apple Inc

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Work type
On-site
Location
Austin, TX
Posted
2 days ago
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Confirmed live today

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Similar $214k
$154k $271k
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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3595 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2772 roles with salary data.

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TL;DR · Digital ASIC Architect

The Digital ASIC Architect joins the Motion Sensing Hardware team to define the digital architecture for motion sensing ASICs from concept through silicon. This role involves analyzing applications to define cost and power optimized digital systems featuring processors, DSP cores, and custom control engines. You will translate high-level requirements into realizable systems by building high-level models and authoring detailed specifications for IC development. Key responsibilities include defining hardware and firmware partitioning, memory hierarchy, bus topology, and clock and power domain structures. You will use MATLAB, Python, SystemC, and C/C++ to develop sensing algorithms and signal processing pipelines. The work focuses on enabling spatial computing, gesture input, head-tracked audio, and crash detection by designing the underlying hardware for IMUs, magnetometers, and pressure sensors.

What you'll do

  • Define digital architectures for motion sensing ASICs by evaluating processors, DSPs, memory, and interface IPs.
  • Perform trade-off analyses to make system-level architectural decisions regarding performance, power, area, and risk.
  • Define hardware/firmware partitioning, memory hierarchy, bus topology, and clock and power domain structures.
  • Develop sensing algorithms and signal processing pipelines using MATLAB, Python, or SystemC to predict performance.
  • Co-simulate digital designs with behavioral analog front-ends and MEMS models to validate full system interactions.
  • Author detailed IP-level and IC-level specifications for processors, memory, bus, and custom control engines.
  • Drive defect root cause analysis and resolution from initial bring-up through mass production.
  • Document architectural assumptions, known risks, and waiver justifications for tape-out readiness sign-off.

What we're looking for

  • BS in Electrical Engineering or related field.
  • Minimum of 10 years of relevant industry experience.
  • Excellent written and verbal communication skills.
  • Deep expertise in digital ASIC architecture for sensor or mixed-signal systems (preferred).
  • Proven track record of defining and taping out high-volume, complex digital and mixed-signal ICs (preferred).
  • Strong foundation in system-level design, requirements development, and hardware/firmware partitioning (preferred).
  • Experience developing sensing algorithms and signal processing pipelines with modeling skills (preferred).
  • Experience with IC bring-up, silicon characterization, and system-level debug (preferred).
  • Proficiency in MATLAB, Python, C/C++, or SystemC for high-level modeling and simulation (preferred).

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