Die-to-Die (D2D) Applications Engineer

Broadcom

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Fort Collins, CO
Salary
$91,100–$146,000 / yr
Employment
Full-time
Posted
41 days ago
Freshness
Confirmed live today
Closes
Jan 9, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $191k
This role $119k
$74k $250k
below market most similar roles pay here above market

This role pays less than 94% of similar roles. Most pay $159,500–$223,450 — the blue band above. At the midpoint, this role pays about $119k versus about $191k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · Die-to-Die (D2D) Applications Engineer

The Die-to-Die (D2D) Applications Engineer joins the ASIC Product Division to serve as the primary technical resource for customers integrating and deploying proprietary D2D PHY IP in silicon. This role bridges hardware, firmware, and software, requiring the engineer to provide deep technical support across the full IP lifecycle, including RTL integration, simulation, silicon bring-up, and production. Key responsibilities include debugging Verilog simulations, providing technical guidance for DFT and ATE production test development, and triaging firmware-related issues. The position requires proficiency in Python, Ruby, Tcl, and C/C++ for debug automation and register-level analysis. The engineer must solve complex, cross-domain integration challenges involving chiplet interconnects and high-speed SerDes/PHY IP to ensure seamless hardware and software functionality within complex cloud computing and networking systems.

What you'll do

  • Provide hands-on technical support to internal and external customers integrating D2D PHY IP into ASICs.
  • Debug and resolve Verilog/RTL simulation issues encountered during customer integration.
  • Support internal DFT and ATE production test development teams with PHY-specific technical guidance.
  • Assist external customers with silicon bring-up, characterization, and production test/debug support.
  • Triage and resolve firmware-related issues from customers using the PHY’s embedded software stack.
  • Diagnose and identify root causes for issues spanning RTL, firmware, and system-level hardware boundaries.
  • Create and improve internal documentation, debug guides, and application notes based on recurring customer issues.
  • Participate in customer-facing technical discussions, including simulation reviews and post-silicon debug sessions.

What we're looking for

  • Bachelor’s Degree in Electrical or Computer Engineering with 5+ years of related experience, or a Master’s degree with 3+ years of related experience.
  • Demonstrated hands-on experience running and debugging Verilog simulations.
  • Strong debugging skills across at least two of the following: RTL/digital logic, firmware, embedded software, or system-level hardware.
  • Ability to trace issues from software/firmware symptoms down to hardware/RTL root causes or vice versa.
  • Solid understanding of digital design fundamentals and standard chip-level interfaces/protocols.
  • Strong communication skills to explain complex technical issues to internal teams and external customers.
  • Scripting skills in Python, Ruby, or Tcl for debug automation and log analysis.
  • Familiarity with embedded firmware development or debug using C/C++, register-level debug, and on-chip debug tools.
  • Direct experience with Die-to-Die (D2D) PHY IP, chiplet interconnects, or high-speed SerDes/PHY IP (preferred).
  • Experience with silicon bring-up, lab debug equipment, and characterization (preferred).
  • Experience supporting DFT and/or ATE test development (scan, BIST, test pattern debug) (preferred).
  • Prior experience in an applications engineering, field applications engineering (FAE), or customer-facing technical support role (preferred).

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