This role pays less than
82%
of similar roles. Most pay
$170,000–$215,000
— the shaded band above.
At the midpoint, this role pays about
$158k
versus about
$192k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
128 open roles
on FindRole.
Listed pay typically runs
$132,750–$182,500
across 128 roles with salary data.
As a Tech Proj/Prog Manager IV, you will join the team to manage projects from conception through implementation while driving strategy, processes, and resource allocation. You will be responsible for managing project schedules, tracking costs, handling purchase orders, and providing technical input to multifunctional teams to ensure on-time performance. The role requires expertise in semiconductor equipment, automation, robotics, and system integration to address the complexities of Special Substrate Handling (SSH). You will translate customer challenges into prioritized product requirements while aligning hardware, software, and metrology teams. This position focuses on solving manufacturing challenges for non-standard substrates, such as warped wafers and glass carriers, which are critical for advanced packaging in AI and high-performance computing. Key skills include technical credibility, strategic thinking, and the ability to navigate ambiguous environments to drive product roadmaps across diverse stakeholder networks.
Develop and manage project plans from initial conception through final implementation.
Manage project schedules, task details, and resource allocation using specialized tracking tools.
Oversee purchase requisitions and monitor cost performance for global customers and vendors.
Translate customer challenges and packaging trends into prioritized product requirements.
Lead cross-functional roadmap planning across hardware, software, automation, and robotics teams.
Act as the system integration leader for Special Substrate Handling capabilities across multiple platforms.
Develop business growth strategies and market assessments to expand market position in advanced packaging.
Identify and resolve technical complications by providing engineering expertise to multifunctional teams.
What we're looking for
Possess deep experience in semiconductor equipment, automation, robotics, substrate handling, or system integration.
Demonstrate ability to operate simultaneously as a Product Manager, Systems Architect, and Program Manager.
Have strong technical credibility with engineering teams while influencing senior business leaders and customers.
Understand advanced packaging technologies, AI/HPC market trends, and manufacturing challenges for non-standard substrates.
Excel at driving alignment across diverse organizations without direct authority.
Demonstrate strong strategic thinking, business acumen, and execution discipline.
10+ years of experience in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development (preferred).
Proven track record leading complex cross-BU initiatives from concept through customer adoption (preferred).
Technical Program Management
Semiconductor Capital Equipment
Systems Integration
Hardware
Software
Product Development
Risk Management
Project Management Tools
Milestone Planning
Epi