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This listing doesn't post a salary. Most similar roles pay
$146,795–$207,325.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
337 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 219 roles with salary data.
The Tech Proj/Prog Manager III S joins the team to lead the Special Substrate Handling (SSH) product vision, strategy, and roadmap. This role functions as a Product Manager, Systems Architect, and Program Manager, driving alignment of system-level requirements across hardware, software, automation, robotics, and metrology teams. Key responsibilities include preparing project plans, managing schedules using tracking charts and scheduling software, and coordinating resources to meet budget and performance objectives. The position requires expertise in semiconductor equipment, substrate handling, and system integration to solve manufacturing challenges for non-standard substrates like warped wafers and glass carriers. You will translate customer challenges into prioritized requirements, manage purchase orders, and provide technical input to multifunctional design teams to enable advanced packaging technologies for AI and high-performance computing.
Prepare project plans and drive projects from initial conception through to final implementation.
Manage project schedules and task details using tracking charts, checklists, and scheduling software.
Coordinate internal resources and manage purchase requisitions to meet on-time and within-budget objectives.
Drive cost and schedule performance for equipment for internal and external customers worldwide.
Provide technical input and engineering expertise to multifunctional design teams to achieve project goals.
Own the SSH product vision, strategy, roadmap, and business case across all business units.
Translate customer challenges and packaging technology trends into prioritized product and platform requirements.
Lead cross-functional roadmap planning across hardware, software, automation, robotics, and metrology teams.
What we're looking for
Possess deep experience in semiconductor equipment, automation, robotics, substrate handling, or system integration.
Demonstrate the ability to operate simultaneously as a Product Manager, Systems Architect, and Program Manager.
Have 10+ years of experience in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development (preferred).
Understand advanced packaging technologies, AI/HPC market trends, and manufacturing challenges for non-standard substrates.
Lead cross-functional roadmap planning and execution across hardware, software, automation, robotics, metrology, and subsystem teams.
Communicate difficult concepts and negotiate with others to adopt different points of view.
Drive alignment across diverse organizations without direct authority to achieve project objectives.
Technical Program Management
AI
Risk Management
Data Integration
Project Lifecycle Management
Software Development
Quality Assurance
Project Governance
Data Sensitivity
Application Ownership
RAID
Project Planning