Lead PCB Design Signal Integrity Stackup Specialist

L3Harris

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Carlsbad, CAPalm Bay, FLHerndon, VA
Salary
$110,500–$205,000 / yr
Posted
6 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $200k
This role $158k
$95k $252k
below market most similar roles pay here above market

This role pays less than 83% of similar roles. Most pay $168,500–$231,300 — the blue band above. At the midpoint, this role pays about $158k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About L3Harris

L3Harris Technologies is a US aerospace and defense technology company providing space and airborne systems, communications, electronic warfare, and missile propulsion solutions for government and commercial customers.

L3Harris currently has 877 open roles on FindRole.

Listed pay typically runs $106,500–$197,500 across 350 roles with salary data.

Most-posted roles

View all roles at L3Harris

At a glance

TL;DR · Lead PCB Design Signal Integrity Stackup Specialist

Lead, PCB Design - Signal Integrity - Stackup Specialist will join the team to define and optimize rigid, rigid-flex, and multilayer PCB stackups. The role involves translating requirements into production-ready strategies for signal integrity, power integrity, impedance control, EMI/EMC, and thermal performance. Key responsibilities include designing stackups for high-speed, mixed-signal, RF, and power applications, defining controlled-impedance structures, and collaborating with electrical, mechanical, and manufacturing teams. The specialist will evaluate tradeoffs across dielectric materials, copper weights, and fabrication constraints while providing layout guidance. Required skills include expertise in transmission lines, return paths, and insertion loss. Preferred tools include Siemens Xpedition, HyperLynx Z-planner, Cadence Allegro, and Altium. The position addresses technical challenges in high-speed design, including crosstalk, resonance, and warpage for complex electronic products.

What you'll do

  • Design and document rigid, rigid-flex, and multilayer PCB stackups for high-speed, RF, and power applications.
  • Define controlled-impedance structures, dielectric materials, copper weights, layer assignments, and via strategies.
  • Translate SI/PI requirements into practical routing rules, return-path planning, grounding, and shielding guidance.
  • Evaluate stackup tradeoffs across electrical performance, EMI/EMC, thermal needs, cost, and manufacturability.
  • Collaborate with PCB fabricators to validate materials, impedance coupons, fabrication tolerances, and production capabilities.
  • Review PCB layouts and fabrication packages to identify stackup-related risks and provide corrective guidance.
  • Maintain stackup drawings, impedance tables, material specifications, and revision history.
  • Resolve prototype and production issues involving impedance, crosstalk, loss, resonance, warpage, or EMI.

What we're looking for

  • Bachelor’s Degree and minimum 9 years of prior relevant experience.
  • Graduate Degree and a minimum of 7 years of prior related experience.
  • Minimum of 13 years of prior related experience in lieu of a degree.
  • Must be a U.S. citizen to obtain a required security clearance.
  • Proficiency with Siemens Xpedition PCB design or experience with similar tools (preferred).
  • Experience using Siemens HyperLynx Z-planner for PCB stackup design (preferred).
  • Experience with DDR, PCIe, USB, Ethernet, SerDes, RF, or high-current power-delivery designs (preferred).
  • IPC Certified Interconnect Designer (CID/CID+) (preferred).

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