IC Package/System Design solution Engineer, Staff

What you'll do

• Conduct IC top-level floorplanning and hard macro block placement.
• Implement high-speed interface SI constraints for jitter, IR drop, cross-talk, and SSN.
• Design power distribution networks (PDNs) from PMIC to SOC for GHz+ processor cores.
• Collaborate on competitive analysis and roadmap package technology for future products.
• Verify packages and SIPs using Valor and ravel checks.
• Optimize cost and area for given package/SIP structures.
• Conduct design reviews with suppliers and Osats.

What we're looking for

• 7+ years of experience in package/SIP/PCB hardware design.
• Expertise in high-speed, dense, multi-layer Packages, PCBs and systems.
• Proficiency in logic design, schematic capture, board layout tools, and testing.
• Strong knowledge of SIPI, PDN, thermal management, and compliance testing.
• Hands-on experience with PCIe, DDR, Ethernet, SerDes, and communication protocols.
• Proven ability to work independently and collaboratively within a cross-functional team environment.
• Strong technical documentation skills and excellent written and verbal communication.