Package Design Engineer - Up to Staff level

Qualcomm

Actively hiring
Santa Clara, CA · San Diego, CA Posted 12 days ago $154,000–$252,800 / year
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At a glance

AI generated

TL;DR

The IC Package Design Engineer role at Qualcomm Technologies, Inc., involves driving advanced package selection and optimization for new generation products, working closely with multi-functional teams to ensure mechanical, electrical, and thermal performance excellence across various chip types. Day-to-day responsibilities include physical design and layout of packages and modules for SoCs, coordinating feasibility analysis and design with internal groups, and developing verification strategies to enhance package design flows. The ideal candidate is proficient in Cadence APD & SiP tools, has a strong grasp of high-speed IO interfaces and electromagnetic fields, and possesses experience with sophisticated package configurations like Flip chip BGA and 2.5D/3D Interposers. This role requires a Master's degree in electrical or mechanical engineering, material science, or related field, along with expertise in Cadence Allegro platform tools and basic understanding of SI/PI tools for high-speed interfaces.

Skills

Cadence_APD SiP High_speed_IO_interfaces IC_packaging_structures Electromagnetic_field_analysis Flip_chip_BGA 2_5D_Interposer 3D_Interposer Cadence_Allegro PCB_Editor Advanced_Package_Designer XtractIM PowerSI HFSS Q3D Calibre_tool Design_Rules_Check High_speed_layout_constraints DDR PCIe UCIE

What you'll do

  • Own and drive advanced package selection and configuration optimization for new generation products.
  • Responsible for physical design and layout optimization of packages and SiPs.
  • Work with multi-functional teams to optimize mechanical, electrical, and thermal performance of chips.
  • Define and develop verification strategies to streamline package design flows.
  • Explore and evaluate new CAD tools and design flows for package development.
  • Optimize chip floorplan and bump placement in collaboration with BU PD team.
  • Ensure package design meets SI/PI requirements and drives methodology improvements.

What we're looking for

  • 5+ years of experience in electrical, mechanical, or material engineering.
  • Proficiency in Cadence APD & SiP tools and advanced package configurations.
  • Knowledge of high-speed IO interfaces (DDR, PCIe) and electromagnetic fields.
  • Experience with substrate manufacturing processes and design rules.
  • Understanding of SI/PI analysis tools and package model extraction techniques.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 595 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 540 roles with salary data.

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