As a Staff IC Packaging Engineer at Qualcomm Technologies, Inc., you will join the cutting-edge team responsible for developing and commercializing advanced integrated circuit packaging technologies. Your primary responsibilities include leading technology development from concept to high-volume manufacturing (HVM), collaborating with Outsourced Semiconductor Assembly and Test partners, and driving new product introductions. You will define package architectures, optimize process flows, and establish Best Known Methods while ensuring robust design for manufacturability. Essential skills include expertise in advanced packaging technologies such as FCCSP, FCBGA, SiP/Modules, RDL-based packages, and 2.5D/3D integration, along with a strong background in reliability testing, statistical data analysis, and process optimization. This role demands hands-on experience with assembly processes, materials, and equipment, as well as familiarity with wafer-level technologies and contract manufacturers.
Skills
FCCSP
FCBGA
SiP/Modules
RDL-based packages
2.5D/3D integration
Design of Experiments
Best Known Methods
Process Control Plans
DFM
FMEA
SPC/QC
Reliability Testing
Failure Analysis
Flip Chip
Wire Bond
Substrate Technologies
Wafer-Level Processes
Laser Groove Technology
Six Sigma
What you'll do
Lead the development and deployment of advanced packaging technologies like FCCSP, FCBGA, SiP/Modules.
Define and optimize package architectures for high-density interconnects and die-to-die integration.
Develop process flows, material sets, Best Known Methods (BKM), and control plans for technology development.
Design and execute experiments to characterize new processes and qualify technologies.
Collaborate with OSAT partners to align technology development with product requirements.
Implement Design for Manufacturability (DFM) and establish design rules in partnership with internal teams.
What we're looking for
Bachelor's degree with 4+ years of experience or advanced degree with relevant work experience.
Expertise in advanced packaging technologies including FCCSP, FCBGA, SiP/Modules, and 2.5D/3D integration.
Experience in defining package architectures, high-density interconnects, and die-to-die (D2D) integration.
Strong knowledge of process flows, material sets, Best Known Methods (BKM), and reliability testing.
Ability to collaborate with OSATs, foundries, substrate vendors, and material suppliers on technology development.
Background in statistical data analysis, Design for Manufacturability (DFM), and cross-functional program management.
Market check
Salary context
This
$154,000–$231,000
range sits above
57%
of similar postings on FindRole.
Peer median band
$146,220–$229,800
Median floor and ceiling across peers.
Typical midpoint (25–75%)
$156,900–$216,250
Middle half of comparable postings.
Based on 240 comparable postings.*
* 240 is the maximum number of comparable postings sampled.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
569 open roles
on FindRole.
Listed pay typically runs
$148,300–$224,400
across 536 roles with salary data.
San Diego, Ca,Us, US150 days ago
$154,000–$231,000
Flip Chip
Wire Bond
System in Package (SiP)
Design for Manufacturability (DFM)
Failure Mode and Effects Analysis (FMEA)
Laser Groove Technology
Package Manufacturing
Technical Project Management
Reliability Test Methods
Six Sigma