IC Packaging Simulation Engineer

Apple Inc

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$126,800–$220,900 / yr
Posted
45 days ago

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $179k
This role $174k
$116k most similar roles pay here $232k

This role pays less than 56% of similar roles. Most pay $152,875–$205,000 — the shaded band above. At the midpoint, this role pays about $174k versus about $179k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 638 open roles on FindRole.

Listed pay typically runs $171,600–$272,100 across 505 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

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We are seeking a self-motivated IC Packaging Simulation Engineer with expertise in Finite Element Method (FEM) simulation using ANSYS or ABAQUS for our hardware team. In this role, you will conduct stress and deformation simulations of integrated circuit packages to ensure high device yield and reliability by analyzing chip-package and package-board interactions. You will also develop automated model-generation user interfaces through scripting CAD/FEM software and integrating generative AI/ML tools. The ideal candidate has hands-on experience with FEM tools, proficiency in MATLAB or Scientific Python, and a deep understanding of packaging materials and processes. This position requires strong problem-solving skills and the ability to support new product introductions while collaborating effectively within a multifaceted organization.

Skills

ANSYS ABAQUS MATLAB Python Hypermesh Generative-AI Machine_Learning CAD FEM Numerical_Simulation_Pods Mechanics MATH Reliability_Engineering_Pods Package_Qualification_Pods

What you'll do

  • Conduct numerical modeling of stress and deformation for IC packages to ensure device yield and reliability.
  • Identify risks related to product yield and reliability through simulation during package definition.
  • Support new product introduction by solving problems in development and manufacturing phases.
  • Script CAD/FEM software and Gen-AI/ML tools to automate model generation interfaces.
  • Maintain and update automated model-generation user interface codes for continuous improvement.

What we're looking for

  • Proven capability in mechanics and mathematics.
  • Hands-on experience with ANSYS or ABAQUS for FEM simulation.
  • Proficiency in scripting CAD/FEM software and setting up automated model-generation interfaces.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures, processes, reliability, and qualification requirements.

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