IC Packaging Simulation Engineer

Apple Inc

Confirmed live yesterday Trusted

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$129,300–$225,300 / yr
Posted
143 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $189k
This role $177k
$118k most similar roles pay here $237k

This role pays less than 59% of similar roles. Most pay $161,965–$216,250 — the shaded band above. At the midpoint, this role pays about $177k versus about $189k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

IC Packaging Simulation Engineer will perform numerical modeling of stress and deformation for component packages to provide a comprehensive understanding of chip-package and package-board interactions. This role is critical for ensuring high device yield and reliability during the product definition, new product introduction, and manufacturing phases. The engineer will actively explore feasibility, identify risks, and solve problems emerging from development. Key responsibilities include programming or scripting CAD/FEM software and utilizing Generative-AI, Machine Learning, and numerical tools to create automated model-generation user interfaces. Required skills include proficiency in ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python. The role requires a deep understanding of packaging materials, mechanical behaviors, and electronic packaging structures. Candidates must possess strong capabilities in mechanics and mathematics while demonstrating the ability to perform independent research and communicate complex data effectively.

What you'll do

  • Perform numerical modeling of stress and deformation for IC packages to ensure device yield and reliability.
  • Analyze chip-package and package-board interactions through comprehensive simulation studies.
  • Evaluate product package feasibility and identify potential risks during the initial design phase.
  • Support new product introduction by solving technical problems arising from development and manufacturing.
  • Develop scripts for CAD/FEM software to automate model-generation user interfaces.
  • Integrate Generative AI, Machine Learning, and numerical tools into automated simulation workflows.
  • Maintain and update codebases used for automated modeling and simulation processes.

What we're looking for

  • A bachelor's degree is required.
  • Proficiency in FEM simulation with multi-year experience in ANSYS or ABAQUS.
  • Proven capability in mechanics and mathematics.
  • Proficiency with numerical simulation software tools, specifically MATLAB and/or Scientific Python.
  • Hands-on experience with Generative AI and Machine Learning.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures, processes, reliability, and qualification requirements.
  • Excellent written and verbal communication skills to present ideas and data confidently.

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