IC Packaging Simulation Engineer
Apple Inc
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Market check
How this pay compares to similar roles
This role pays less than 59% of similar roles. Most pay $161,965–$216,250 — the shaded band above. At the midpoint, this role pays about $177k versus about $189k for comparable roles.
Based on 240 similar postings.
Employer
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has 1984 open roles on FindRole.
Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.
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At a glance
IC Packaging Simulation Engineer will perform numerical modeling of stress and deformation for component packages to provide a comprehensive understanding of chip-package and package-board interactions. This role is critical for ensuring high device yield and reliability during the product definition, new product introduction, and manufacturing phases. The engineer will actively explore feasibility, identify risks, and solve problems emerging from development. Key responsibilities include programming or scripting CAD/FEM software and utilizing Generative-AI, Machine Learning, and numerical tools to create automated model-generation user interfaces. Required skills include proficiency in ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python. The role requires a deep understanding of packaging materials, mechanical behaviors, and electronic packaging structures. Candidates must possess strong capabilities in mechanics and mathematics while demonstrating the ability to perform independent research and communicate complex data effectively.
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What you'll do
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