IC Packaging Simulation Engineer

Apple Inc

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$181,100–$318,400 / yr
Posted
36 days ago

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $179k
This role $250k
$114k most similar roles pay here $340k

This role pays more than 98% of similar roles. Most pay $152,875–$205,000 — the shaded band above. At the midpoint, this role pays about $250k versus about $179k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 638 open roles on FindRole.

Listed pay typically runs $171,600–$272,100 across 505 roles with salary data.

Most-posted roles

View all roles at Apple Inc

At a glance

TL;DR · IC Packaging Simulation Engineer

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As an IC Packaging Simulation Engineer at this innovative hardware company, you will join a dynamic team focused on advancing semiconductor packaging technologies. Your primary responsibilities include conducting stress and deformation simulations for integrated circuit packages to ensure optimal device yield and reliability through comprehensive chip-package interaction analysis. You will develop automated model-generation interfaces using CAD/FEM software and generative AI/ML tools, scripting these systems to enhance efficiency in product development cycles. The ideal candidate possesses extensive experience with FEM simulation software like ANSYS or ABAQUS, alongside proficiency in numerical simulation tools such as MATLAB or Scientific Python. Additionally, a deep understanding of packaging materials and electronic structures is crucial for addressing complex reliability challenges in high-scale manufacturing environments.

Skills

ANSYS ABAQUS Hypermesh MATLAB Python Machine Learning CAD FEM Generative AI Numerical Simulation Tools

What you'll do

  • Conduct stress and deformation simulation of IC packages to ensure device yield and reliability.
  • Explore feasibility during product package definition to identify risks through simulation.
  • Support new product introduction by solving problems in development and manufacturing.
  • Script CAD/FEM software and Gen-AI/ML tools for automated model-generation interfaces.
  • Maintain and update codes for automated model-generation user interfaces.

What we're looking for

  • At least 10 years of relevant industry experience or equivalent education in a technical field.
  • Proficiency in FEM simulation software such as ANSYS or ABAQUS.
  • Hands-on experience with CAD/FEM scripting and generative AI/ML tools.
  • Deep understanding of packaging materials, their mechanical behaviors, and electronic packaging processes.
  • Ability to perform independent research and development work on simulation projects.
  • Excellent communication skills for presenting technical concepts and data in team settings.

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