IC Packaging Simulation Engineer

Apple Inc

Confirmed live 2 days ago Trusted

Quick summary

Work type
On-site
Location
San Francisco, CA
Salary
$184,700–$324,800 / yr
Posted
134 days ago
Freshness
Confirmed live 2 days ago

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $189k
This role $255k
$129k most similar roles pay here $346k

This role pays more than 95% of similar roles. Most pay $161,575–$216,250 — the shaded band above. At the midpoint, this role pays about $255k versus about $189k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

The IC Packaging Simulation Engineer performs numerical modeling of stress and deformation for component packages to provide a comprehensive understanding of chip-package and package-board interactions, ensuring high device yield and reliability. This role involves identifying risks during product package definition, supporting new product introduction, and solving problems emerging from manufacturing. The engineer will develop automated model-generation user interfaces by programming or scripting CAD/FEM software, Generative-AI, Machine Learning, and numerical tools. Key technical requirements include proficiency in ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python. Candidates must possess a deep understanding of packaging materials, mechanical behaviors, and electronic packaging structures. The role requires expertise in mechanics and mathematics to conduct independent research while communicating design concepts and data clearly within a multifaceted collaborative organization to solve complex reliability and qualification challenges.

What you'll do

  • Perform numerical modeling of stress and deformation for IC packages to ensure device yield and reliability.
  • Analyze chip-package and package-board interactions through comprehensive simulation studies.
  • Evaluate the feasibility of product designs and identify potential reliability risks during the definition phase.
  • Support new product introduction by solving technical problems arising from development and manufacturing.
  • Develop scripts for CAD/FEM software to automate model-generation user interfaces.
  • Integrate Generative AI, Machine Learning, and numerical tools into simulation workflows.
  • Maintain and update automated codebases for modeling and simulation processes.

What we're looking for

  • Bachelor of Science degree required.
  • Minimum of 10 years of relevant industry experience or equivalent.
  • Proficiency in FEM simulation using software such as ANSYS or ABAQUS.
  • Expertise in MATLAB and/or Scientific Python for numerical simulation tools.
  • Hands-on experience with Generative AI and Machine Learning.
  • Proven capability in mechanics and mathematics.
  • Deep understanding of packaging materials, mechanical behaviors, and electronic packaging structures.
  • Ability to script CAD/FEM software and develop automated model-generation user interfaces.

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