IC Packaging Simulation Engineer
Apple Inc
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How this pay compares to similar roles
This role pays more than 95% of similar roles. Most pay $161,575–$216,250 — the shaded band above. At the midpoint, this role pays about $255k versus about $189k for comparable roles.
Based on 240 similar postings.
Employer
Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software
Apple Inc currently has 1984 open roles on FindRole.
Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.
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At a glance
The IC Packaging Simulation Engineer performs numerical modeling of stress and deformation for component packages to provide a comprehensive understanding of chip-package and package-board interactions, ensuring high device yield and reliability. This role involves identifying risks during product package definition, supporting new product introduction, and solving problems emerging from manufacturing. The engineer will develop automated model-generation user interfaces by programming or scripting CAD/FEM software, Generative-AI, Machine Learning, and numerical tools. Key technical requirements include proficiency in ANSYS, ABAQUS, Hypermesh, MATLAB, and Scientific Python. Candidates must possess a deep understanding of packaging materials, mechanical behaviors, and electronic packaging structures. The role requires expertise in mechanics and mathematics to conduct independent research while communicating design concepts and data clearly within a multifaceted collaborative organization to solve complex reliability and qualification challenges.
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