IC Packaging Simulation Engineer

Apple Inc

Confirmed live 2 days ago Trusted

Quick summary

Work type
On-site
Location
Austin, TX
Posted
134 days ago
Freshness
Confirmed live 2 days ago

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How this pay compares to similar roles

Similar $189k
$141k most similar roles pay here $234k

This listing doesn't post a salary. Most similar roles pay $161,965–$216,250.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

As an IC Packaging Simulation Engineer, you will join a multifaceted collaborative organization to perform numerical modeling of stress and deformation for component packages. Your primary focus involves analyzing chip-package and package-board interactions to ensure high device yield and reliability throughout the product development and manufacturing stages. You will actively explore feasibility during product definition while identifying potential risks to reliability. The role requires developing automated model-generation user interfaces through scripting CAD and FEM software, as well as utilizing Generative-AI, Machine Learning, and numerical tools. To succeed, you must possess expertise in ANSYS or ABAQUS, MATLAB, and Scientific Python. You will apply deep knowledge of packaging materials, mechanical behaviors, and electronic packaging structures to solve complex technical problems while performing independent research and development work within the semiconductor hardware domain.

What you'll do

  • Perform numerical modeling of stress and deformation for IC packages to ensure device yield and reliability.
  • Analyze chip-package and package-board interactions through comprehensive simulation studies.
  • Evaluate product package definitions to identify potential risks to reliability and manufacturing yield.
  • Support new product introduction by solving technical problems arising during development and manufacturing.
  • Script CAD/FEM software and integrate Gen-AI or Machine Learning tools for automated model generation.
  • Maintain and update codebases for automated user interfaces in simulation workflows.

What we're looking for

  • Bachelor of Science degree and at least 10 years of relevant industry experience.
  • Proficiency in FEM simulation using software such as ANSYS or ABAQUS.
  • Expertise in MATLAB and/or Scientific Python for numerical simulation tools.
  • Experience with Generative AI, Machine Learning, and numerical tools for automated model generation.
  • Proven capability in mechanics and mathematics.
  • Deep understanding of packaging materials and their mechanical behaviors.
  • Knowledge of electronic packaging structures, processes, reliability, and qualification requirements.
  • Excellent written and verbal communication skills to present data and design concepts.

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