IC Packaging Simulation Engineer

Apple Inc

Quick summary

Work type
On-site
Location
Austin, TX
Posted
36 days ago

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Salary context

How this pay compares to similar roles

Similar $179k
$126k most similar roles pay here $228k

This listing doesn't post a salary. Most similar roles pay $152,875–$205,000.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 638 open roles on FindRole.

Listed pay typically runs $171,600–$272,100 across 505 roles with salary data.

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At a glance

TL;DR · IC Packaging Simulation Engineer

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As an IC Packaging Simulation Engineer at this innovative hardware company, you will join a dynamic team focused on advancing semiconductor packaging technologies. Your primary responsibilities include conducting stress and deformation simulations for integrated circuit packages using ANSYS or ABAQUS to ensure optimal device yield and reliability. You will also develop automated model-generation interfaces by scripting CAD/FEM software and integrating generative AI/ML tools, supporting new product introductions and addressing manufacturing challenges. This role demands expertise in finite element method (FEM) simulation, proficiency with MATLAB or Scientific Python, and a deep understanding of packaging materials and processes. Ideal candidates have at least 10 years of industry experience and a strong background in mechanics and mathematics, making significant contributions to the field through independent research and development.

Skills

ANSYS ABAQUS MATLAB Python AI Machine Learning CAD FEM Hypermesh

What you'll do

  • Conduct stress and deformation simulation of IC packages to ensure device yield and reliability.
  • Identify risks in product reliability and yield through feasibility exploration during package definition.
  • Develop automated model-generation user interfaces using CAD/FEM software and scripting languages.
  • Support new product introduction by solving problems related to development and manufacturing.
  • Utilize generative AI, machine learning, and numerical tools for simulation project automation.
  • Maintain and update scripts and codes for automated model generation interfaces.

What we're looking for

  • Minimum 10 years of relevant industry experience in IC packaging simulation or equivalent.
  • Proficiency in FEM software such as ANSYS or ABAQUS for stress and deformation simulations.
  • Hands-on experience with CAD/FEM scripting and automation using programming languages like Python.
  • Expertise in numerical simulation tools, including MATLAB and Scientific Python.
  • Knowledge of electronic packaging materials, structures, processes, and reliability requirements.
  • Ability to conduct independent research and development work on complex projects.
  • Strong communication skills for presenting technical concepts and data at team meetings.

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