Process Integration Engineer

Applied Materials

Confirmed live 2 days ago Trusted

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$147,000–$202,500 / yr
Posted
101 days ago
Freshness
Confirmed live 2 days ago

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $169k
This role $175k
$120k most similar roles pay here $211k

This role pays more than 60% of similar roles. Most pay $140,189–$197,500 — the shaded band above. At the midpoint, this role pays about $175k versus about $169k for comparable roles.

Based on 240 similar postings.

Employer

About Applied Materials

Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment

Applied Materials currently has 128 open roles on FindRole.

Listed pay typically runs $132,750–$182,500 across 128 roles with salary data.

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At a glance

TL;DR · Process Integration Engineer

As a Process Integration Engineer, you will join the engineering team to lead process integration for advanced semiconductor and photonic devices, specifically focusing on next-generation high-performance interconnect technologies. You will translate device architectures into manufacturable process flows, manage build scheduling, perform risk assessments, and drive yield improvements through SPC and CIP across complex fabrication flows. Your daily work involves conducting optical, electrical, and tolerance analyses to improve device scalability while collaborating with cross-functional teams and external vendors for material selection and process scaling. You will utilize tools such as Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, and ANSYS to solve technical challenges. The role requires expertise in lithography, etch, thin film deposition, metallization, implant, and CMP within the context of semiconductor manufacturing, advanced packaging, and heterogeneous integration for display and semiconductor technologies.

What you'll do

  • Lead process integration for advanced semiconductor and photonic devices to enable high-performance interconnect technologies.
  • Translate device architectures and design layouts into robust, manufacturable process flows.
  • Drive C&F activities including rapid proof-of-concept and prototyping builds.
  • Define and track critical process parameters and integration metrics to optimize unit processes.
  • Manage end-to-end integration flow execution including process definition, build scheduling, and risk assessment.
  • Drive yield improvement, statistical process control (SPC), and continuous improvement across fabrication flows.
  • Conduct optical, electrical, and tolerance analyses to improve device efficiency and manufacturability.
  • Engage with external vendors and customers to support material selection and process scaling.

What we're looking for

  • Ph.D. in Electrical Engineering, Materials Science, Physics, or a related discipline is required.
  • A Master's degree with relevant industry experience will be considered in lieu of a Ph.D.
  • Candidates must have strong experience in semiconductor process integration within a leading fab or foundry.
  • Applicants must possess a solid understanding of unit processes including lithography, etch, thin film deposition, metallization, implant, and CMP.
  • Experience in yield analysis, metrology, and SPC implementation is required.
  • Proficiency with simulation and design tools such as Cadence, KLayout, AutoCAD, SolidWorks, COMSOL, or ANSYS is required.
  • Candidates should have experience in photonic devices, co-packaged optics, or optical interconnect technologies.
  • A background in advanced packaging and heterogeneous integration is preferred.

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