below marketmost similar roles pay hereabove market
This role pays more than
66%
of similar roles. Most pay
$169,550–$225,500
— the blue band above.
At the midpoint, this role pays about
$209k
versus about
$198k
for comparable roles.
Based on 240 similar postings.
Employer
About Microsoft
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has
694 open roles
on FindRole.
Listed pay typically runs
$119,800–$234,700
across 651 roles with salary data.
The Principal Package Engineer joins the Silicon Manufacturing and Product Engineering team within the Compute Silicon & Manufacturing Engineering organization. This role supports the design, development, and manufacturing of Microsoft's state-of-the-art computer chips, specifically the Azure Cobalt. The engineer will lead advanced packaging technology selection, qualification, and manufacturing for chiplet architectures using 2.5D and 3D packaging. Key responsibilities include driving product designs for bridges, interposers, and substrates from definition to tapeout, developing test vehicles to validate system performance, and managing supplier assessments. The role requires expertise in substrate design, FMEA, and reliability characterization of Integrated Circuits. Candidates must possess skills in high-speed signaling, thermo-mechanical FEA, and 2D and 3D simulation tools for power and signals analysis to solve complex cloud hardware infrastructure challenges.
Drive optimal silicon packaging solutions to support the Azure datacenter product roadmap.
Lead 2.5D/3D packaging product designs from initial definition through development to tapeout.
Define and develop test vehicles to validate silicon, package, and system performance.
Manage suppliers through the entire lifecycle of definition, development, qualification, and production.
Develop and deliver Failure Mode and Effects Analysis (FMEA) for various technology options.
Design and develop package and assembly drawings to support manufacturing processes.
Assess and characterize the reliability of Integrated Circuit (IC) packages.
Define EDA tool requirements for advanced 3DIC packaging designs.
What we're looking for
Require a Doctorate with 3+ years experience, a Master's with 6+ years experience, or a Bachelor's with 8+ years experience in a related field.
Require the ability to pass Microsoft Cloud Background Checks and other government security screenings.
Require proof of citizenship, US residency, or other protected status to access export-controlled information.
Require 15+ years of hands-on experience in semiconductor package design, development, manufacturing, supplier management, or quality management (preferred).
Require specific experience with advanced semiconductor package technologies such as BGA, 2.5D, or 3D (preferred).
Require working knowledge of high-speed signaling, layout, electrical, mechanical, and thermal co-designs (preferred).
Require experience in thermo-mechanical FEA and translating simulation results into product design requirements (preferred).
Require experience with OSAT, supplier and foundry technologies, and physical failure analysis (preferred).
Semiconductor IC Development
ATE Test Program Development
DFT
Silicon Fabrication
Yield Analysis
Failure Analysis
Integrated Circuits
SoC
LDOs
Integrated VRs
Transistor Theory
Product Q&R
High-Performance Computing
AI
GPUs
CPUs
Linux
C
C++
Golang
Python
Docker
Kubernetes
Microservices
Distributed Systems
DOCSIS
CMTS
vCMTS
PON
Messaging
Event-driven Architecture
Telemetry
Network Infrastructure