This role pays less than
71%
of similar roles. Most pay
$205,000–$282,150
— the shaded band above.
At the midpoint, this role pays about
$209k
versus about
$244k
for comparable roles.
Based on 240 similar postings.
Employer
About Microsoft
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has
598 open roles
on FindRole.
Listed pay typically runs
$119,800–$234,700
across 586 roles with salary data.
The Director of Package Design joins the advanced packaging design team within the Silicon Manufacturing and Product Engineering organization to support the development of Azure datacenter products. This leader will mentor engineers while driving optimal silicon packaging solutions, specifically focusing on chiplet architecture with advanced 2.5D/3D packaging technologies including bridge, interposer, and substrate designs. Daily responsibilities involve managing supplier assessments, developing test vehicles for performance validation, performing failure mode and effects analysis, and creating assembly drawings to support manufacturing. The role requires expertise in high-speed signaling, thermal co-designs, and 2D and 3D simulation tools for power and signal analysis. Candidates should be proficient in Cadence Allegro and possess deep knowledge of IC package reliability, physical failure analysis, and OSAT technologies to solve complex hardware infrastructure challenges within the cloud computing domain.
Lead and mentor a team of package design engineers to support their career growth and development.
Drive optimal silicon packaging solutions for the Azure datacenter product roadmap.
Manage 2.5D/3D packaging designs including bridge, interposer, and substrate from definition through tapeout.
Develop test vehicles to validate Silicon, Package, and System performance.
Manage supplier assessments and oversee suppliers through definition, development, qualification, and production.
Perform Failure Mode and Effects Analysis (FMEA) for various technology options.
Define EDA tool requirements for advanced 3DIC packaging designs.
Characterize the reliability of Integrated Circuits (IC) packages.
What we're looking for
A Doctorate in Electrical Engineering, Computer Engineering, or Computer Science and 3+ years of experience, OR a Master's degree and 6+ years, OR a Bachelor's degree and 8+ years.
Equivalent technical engineering experience to the specified degree/experience combinations is acceptable.
Ability to pass Microsoft Cloud Background Check and meet government security screening requirements.
Must provide proof of citizenship or protected status for access to export-controlled information.
15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management, or quality management (preferred).
Experience with Advanced Semiconductor Package technologies such as BGA, 2.5D, and 3D (preferred).
Proficiency in IC package or PCB board layout CAD tools like Cadence Allegro (preferred).
Working knowledge of high-speed signaling, layout, electrical, mechanical, and thermal co-designs (preferred).