Principal Board Package Co-design Architect
Arm Holdings
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How this pay compares to similar roles
This role pays more than 90% of similar roles. Most pay $194,782–$245,000 — the shaded band above. At the midpoint, this role pays about $294k versus about $220k for comparable roles.
Based on 240 similar postings.
Employer
Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.
Arm Holdings currently has 39 open roles on FindRole.
Listed pay typically runs $208,450–$282,050 across 38 roles with salary data.
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At a glance
As a Principal Board - Package co-design Architect, you will join the Packaging, Boards and Multiphysics team to develop physical hardware development platforms based around custom Arm SoC. You will collaborate with global engineering groups to define technical requirements for PCB and silicon package integration, focusing on breakout, routing strategies, design rules, and layer optimization. Your role involves translating technology requirements into platform architectures while evaluating trade-offs between signal integrity, power integrity, and manufacturability. You will utilize Cadence OrCAD and Allegro tools to manage complex LSI devices, including FPGAs and PMICs. The work centers on the embedded compute space, specifically addressing challenges in high-performance systems for Cloud/Edge AI and IoT. Key technical areas include high-speed IO standards like PCIe Gen5/6/7 and LPDDR5/6, as well as advanced PCB fabrication processes such as PTH and HDI.
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