This role pays more than
72%
of similar roles. Most pay
$170,750–$227,350
— the shaded band above.
At the midpoint, this role pays about
$220k
versus about
$199k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
615 open roles
on FindRole.
Listed pay typically runs
$155,400–$232,600
across 593 roles with salary data.
As a CPU Integration & 3DIC CAD Engineer on the Nuvia/CPU team, you will build and support implementation tools and flows to ensure custom CPUs achieve industry-leading power, performance, and area. Your daily responsibilities include collaborating with cross-functional design and CAD teams to enable 3DIC and multi-die integration within existing or new flows. You will manage specific tasks such as TSV planning during floor planning, static timing and extraction across multiple dies, and power integrity flows for chiplets. Additionally, you will architect, maintain, and support these flows while working with EDA vendors to resolve tool issues and define roadmaps. The role requires proficiency in Python and Tcl, experience with advanced technology nodes like 5nm or lower, and familiarity with tools such as Innovus, Primetime, or Star-RC to solve complex multi-die integration challenges.