CPU Integration & 3DIC CAD Engineer
Qualcomm
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How this pay compares to similar roles
This role pays more than 70% of similar roles. Most pay $162,000–$231,150 — the blue band above. At the midpoint, this role pays about $220k versus about $197k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
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At a glance
The CPU Integration CAD Engineer joins the CPU Engineering group to build and support world-class implementation tools and flows. This role focuses on ensuring custom CPUs achieve industry-leading power, performance, and area. The engineer will develop, integrate, and release methodologies for floorplanning, including power planning and pin placement, as well as PDV analysis such as DRC, LVS, and antenna checks. Key responsibilities include architecting and maintaining implementation flows, resolving project-specific issues, and collaborating with EDA vendors to define roadmaps. Candidates must possess programming proficiency in Python and Tcl, knowledge of data structures and algorithms, and experience with automation. Technical requirements include familiarity with Innovus PNR tools, Calibre PDV tools, and physical design tasks like place-and-route, timing sign-off, and advanced technology nodes at 5nm or lower.
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