below marketmost similar roles pay hereabove market
This role pays more than
70%
of similar roles. Most pay
$168,500–$246,212
— the blue band above.
At the midpoint, this role pays about
$238k
versus about
$207k
for comparable roles.
Based on 240 similar postings.
Employer
About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
344 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 217 roles with salary data.
The Advanced Packaging Technology & Integration Leader will lead the development of next-generation semiconductor packaging and 3D integration technologies. This role involves leading cross-functional teams to develop differentiated technologies from first principles, translating fundamental physics and materials behavior into practical solutions. Key responsibilities include identifying limitations in AI/HPC and memory architectures, establishing technology roadmaps, and driving processes from concept to manufacturable solutions. The position requires expertise in hybrid bonding, through-silicon vias, thermal management, interposers, bridge-die architectures, and heterogeneous integration. Candidates must demonstrate proficiency in semiconductor process integration, including deposition, etch, CMP, and lithography. The role solves critical technical challenges in scaling bond-pad pitch, managing thermal-mechanical reliability, and developing high-density interconnects for advanced logic-memory and chiplet integration systems.
Develop differentiated semiconductor packaging technologies from first principles by analyzing materials, interfaces, and process physics.
Identify critical technology limitations for AI/HPC and memory architectures and design new approaches to overcome them.
Establish technology roadmaps connecting future device requirements to new materials, processes, and equipment capabilities.
Create complete process-integration strategies that account for trade-offs in thermal budget, stress, topology, and electrical performance.
Lead multidisciplinary teams of engineers and scientists to move technologies from early concepts to manufacturable solutions.
Engage with logic, memory, and foundry customers to translate their architecture requirements into technology-development programs.
Mentor senior technical staff and develop future technical leaders within the organization.
Represent the company as a technical authority in advanced packaging and heterogeneous integration to external partners.
What we're looking for
Advanced degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, or equivalent semiconductor technology-development expertise (preferred).
Demonstrated experience developing semiconductor technologies or integration schemes from early concept through experimental validation.
Deep understanding of semiconductor process integration.
Strong expertise in several areas including hybrid bonding, TSV technology, 2.5D/3D integration, interposers, bridge die, or thermal-management materials.
Ability to reason from fundamental physics and materials behavior when established solutions are insufficient.
Demonstrated ability to define experiments that distinguish between competing physical mechanisms and accelerate technical learning.
Strong record of leading complex, multidisciplinary semiconductor technology-development programs.
Demonstrated ability to mentor technical teams and influence organizations beyond direct reporting relationships.
Semiconductor Packaging Design
SiP Packaging
Cadence APD
Allegro
Signal Integrity
Power Integrity
Design for Manufacturing
NPI
Package Layout
Si Floor Plan
Process & Technology Development
reliability, testing
BOM
HVM