IC Packaging Integration Engineer

Apple Inc

Confirmed live today High trust

Quick summary

Work type: On-site
Location: —
Salary: $184,700–$324,800 / yr
Posted: 70 days ago
Freshness: Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $198k

This role $255k

$129k most similar roles pay here $346k

This role pays more than 97% of similar roles. Most pay $158,450–$238,000 — the shaded band above. At the midpoint, this role pays about $255k versus about $198k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

Most-posted roles

View all roles at Apple Inc

At a glance

TL;DR · IC Packaging Integration Engineer

Role Posting Log in to save

The IC Packaging Integration Engineer joins the hardware team to lead package integration and architecture efforts while collaborating with cross-functional teams including Silicon, Packaging, and Systems engineering. This role involves driving package technology development to improve performance and lower costs, managing the transition of innovative solutions from concept to high volume manufacturing, and coordinating with assembly partners through NPI and qualification stages. The candidate will create design documentation, technical risk assessments, and design rules while ensuring packages meet electrical, mechanical, thermal, and reliability requirements. Key skills include expertise in semiconductor packaging design, SiP packaging, and layout tools like Cadence APD or Allegro. The role addresses complex challenges in high-density interconnects, signal integrity, power integrity, and thermo-mechanical constraints to deliver advanced package solutions for various form factors and manufacturing requirements.