Advanced Packaging Design Engineering Team Leader
Cisco
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How this pay compares to similar roles
This role pays more than 94% of similar roles. Most pay $173,781–$231,300 — the blue band above. At the midpoint, this role pays about $262k versus about $203k for comparable roles.
Based on 240 similar postings.
Employer
Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity
Cisco currently has 312 open roles on FindRole.
Listed pay typically runs $167,700–$245,000 across 223 roles with salary data.
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At a glance
The Advanced Packaging Layout Engineering Team Leader (Substrate & Interposer) joins the Cisco Silicon One team to lead and grow the San Jose layout group. This role involves providing hands-on technical guidance, mentorship, and resource coordination for complex package programs, specifically focusing on advanced ASIC packaging and CoWoS projects. The leader will drive layout activities, optimize package pinouts, stack-ups, power distribution, and escape routing while collaborating with SI/PI teams and manufacturing partners. Key responsibilities include improving methodologies, managing staffing, and ensuring high-quality implementation of high-speed interfaces. Required skills include experience with package layout, power distribution networks, and industry-standard EDA tools like Cadence APD+. Candidates should also possess proficiency in scripting languages such as Python, Perl, or TCL to support engineering efficiency.
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