Packaging Substrate Engineer

Apple Inc

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Work type: On-site
Location: Austin, TX
Posted: 1 day ago
Freshness: Confirmed live today
Nearby: 99+ roles within 25 mi

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How this pay compares to similar roles

Similar $209k

$148k $268k

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This listing doesn't post a salary. Most similar roles pay $177,237–$241,750.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3515 open roles on FindRole.

Listed pay typically runs $174,149–$277,600 across 2718 roles with salary data.

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At a glance

TL;DR · Packaging Substrate Engineer

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The Packaging Substrate Engineer joins the Hardware Technology Packaging team to invent, design, develop, and integrate electronic packaging solutions for internal and custom external components of consumer electronic products. This role involves owning sophisticated package selection, new-generation package structure optimization, and driving the roadmap for package substrates including design, technology, manufacturing, and reliability. Key responsibilities include leading SoC package substrate technology development, pathfinding, and working with industry partners, foundries, and OSATs to move solutions from concept to high-volume manufacturing. The position requires expertise in material, chemistry, and mechanical engineering, specifically regarding Cu plating, lithography, dielectric materials, via formation, solder resist, and surface finish. Candidates must utilize Cadence Allegro platform tools for design review for manufacturing while solving technical issues throughout the full product development cycle.

Skills

Substrate Technology Cu Plating Lithography Via Formation Solder Resist Surface Finish Cadence Allegro DFM Package Assembly Mechanical Engineering Chemistry HVM Process Development

What you'll do

Lead SoC package substrate technology development, pathfinding, and roadmap definition.
Develop new substrate technologies from concept to high-volume manufacturing with industry partners.
Define and optimize new package substrate architectures based on performance, risk, cost, and availability.
Drive development of new package architectures, materials, processes, and specification definitions.
Solve technical issues during the full product development cycle.
Manage the design, technology, manufacturing, and reliability of Apple package substrates.
Oversee substrate manufacturing processes including Cu plating, lithography, and dielectric material application.

What we're looking for

BS and 10+ years of relevant industry experience.
MS or Ph.D. and 8+ years of relevant industry experience (preferred).
Proven fundamentals in material, chemistry, or mechanical engineering field(s) (preferred).
In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap (preferred).
Hands-on experience in substrate manufacturing and technology development including Cu plating, lithography, and dielectric materials (preferred).
Experience in Cadence Allegro platform tools and design review for manufacturing (preferred).
Exceptional technology development and project management skills (preferred).
Strong communication and collaborative skills (preferred).

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