Advanced Packaging Design Engineering Team Leader

Cisco

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
San Jose, CA
Salary
$214,100–$309,800 / yr
Employment
Full-time
Posted
2 days ago
Freshness
Confirmed live today
Closes
Jan 29, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $202k
This role $262k
$142k $328k
below market most similar roles pay here above market

This role pays more than 90% of similar roles. Most pay $174,750–$229,875 — the blue band above. At the midpoint, this role pays about $262k versus about $202k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 312 open roles on FindRole.

Listed pay typically runs $167,700–$245,000 across 223 roles with salary data.

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At a glance

TL;DR · Advanced Packaging Design Engineering Team Leader

The Advanced Packaging Design Engineering Team Leader joins the Cisco Silicon One team to drive complex package design programs for high-performance Silicon ASICs. This role involves leading the San Jose package design team, mentoring engineers, and managing projects from concept through tapeout. Key responsibilities include optimizing package pinouts, stack-ups, power distribution, and high-speed routing while ensuring alignment with signal integrity and power integrity requirements. The successful candidate will utilize industry-standard EDA tools for package layout and design, and may use scripting languages like Python, Perl, TCL, or shell programming. The work focuses on large-scale integration using 2.5D fanout technologies to solve complex networking problems, specifically developing robust, scalable solutions for global networks and next-generation ASIC platforms within a specialized hardware development environment.

What you'll do

  • Lead complex package design programs from initial concept through implementation and tapeout.
  • Optimize package pinouts, stack-ups, power distribution, and high-speed routing for performance and reliability.
  • Collaborate with silicon floor planning, signal integrity, and power integrity teams to ensure system-level alignment.
  • Serve as the technical and organizational leader for the San Jose package design team.
  • Mentor engineers and develop technical talent to take ownership of complex package programs.
  • Coordinate resources across designers, layout editors, and contractors to ensure efficient project execution.
  • Enhance package design methodologies and partner with vendors to improve product quality and efficiency.

What we're looking for

  • Must live within commuting distance of the San Jose, CA office and commute 4-5 days per week.
  • Bachelor’s degree in electrical engineering or a related field with 12+ years of work experience.
  • Master’s degree in Electrical Engineering or a related field with 8+ years of work experience.
  • Experience in high-speed package design, including signal integrity considerations and power distribution networks.
  • Experience with industry-standard EDA tools for package layout and design.
  • Experience with technical leadership in complex hardware or silicon development programs.
  • Extensive experience in ASIC package design, including pinout optimization and high-speed routing (preferred).
  • Experience with testing and measurement equipment or scripting languages such as Python, Perl, or TCL (preferred).

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