Advanced Packaging Layout Engineering Team Leader, Substrate & Interposer
Cisco
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How this pay compares to similar roles
This role pays more than 90% of similar roles. Most pay $174,750–$229,875 — the blue band above. At the midpoint, this role pays about $262k versus about $202k for comparable roles.
Based on 240 similar postings.
Employer
Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity
Cisco currently has 312 open roles on FindRole.
Listed pay typically runs $167,700–$245,000 across 223 roles with salary data.
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At a glance
The Advanced Packaging Design Engineering Team Leader joins the Cisco Silicon One team to drive complex package design programs for high-performance Silicon ASICs. This role involves leading the San Jose package design team, mentoring engineers, and managing projects from concept through tapeout. Key responsibilities include optimizing package pinouts, stack-ups, power distribution, and high-speed routing while ensuring alignment with signal integrity and power integrity requirements. The successful candidate will utilize industry-standard EDA tools for package layout and design, and may use scripting languages like Python, Perl, TCL, or shell programming. The work focuses on large-scale integration using 2.5D fanout technologies to solve complex networking problems, specifically developing robust, scalable solutions for global networks and next-generation ASIC platforms within a specialized hardware development environment.
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