System Test HW Engineer

Amazon Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Austin, TXRedmond, WA
Salary
$136,000–$184,000 / yr
Posted
35 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $170k
This role $160k
$129k most similar roles pay here $201k

This role pays less than 63% of similar roles. Most pay $152,000–$187,200 — the shaded band above. At the midpoint, this role pays about $160k versus about $170k for comparable roles.

Based on 240 similar postings.

Employer

About Amazon Inc

Amazon Inc. is the world''s largest e-commerce and cloud computing company, operating the Amazon marketplace, AWS cloud platform, Prime subscription services, Alexa voice AI, and logistics infrastructure. Industry: E-Commerce & Cloud Computing

Amazon Inc currently has 457 open roles on FindRole.

Listed pay typically runs $143,700–$194,400 across 447 roles with salary data.

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At a glance

TL;DR · System Test HW Engineer

System Test HW Engineer, Amazon LEO joins the ASIC Team to own PCB design for test and software development platforms. This role is critical for the validation and bring-up of next-generation MODEM SOCs designed for space environments. The engineer will design, optimize, and develop multi-layer PCB schematics and layouts using Siemens Xpedition while collaborating with silicon, firmware, and software teams to ensure hardware meets early bring-up needs. Key responsibilities include managing the board lifecycle from concept through fabrication, performing signal and power integrity analysis, and implementing high-speed interfaces like SerDes, DDR, and Ethernet SGMII/RGMII. The role requires expertise in low-speed protocols such as I2C, SPI, and I3C, alongside experience with impedance-controlled routing and high-density BGA fanout. This position solves the technical challenge of accelerating the path from tape-out to orbit for satellite communications hardware.

What you'll do

  • Design and optimize PCB schematics and layouts for SOC validation and software development platforms using Siemens Xpedition.
  • Define board requirements including debug access, instrumentation tap points, and high-speed interface breakouts like SerDes and DDR.
  • Ensure development boards meet early software bring-up and driver development needs in coordination with firmware teams.
  • Translate silicon requirements into hardware implementations by collaborating with ASIC, firmware, and mechanical teams.
  • Review signal integrity and power integrity analyses to incorporate necessary improvements into the PCB layout.
  • Manage the full board lifecycle from initial concept through fabrication, assembly, bring-up, and ECO management.

What we're looking for

  • Bachelor's degree in Electrical Engineering or a related field.
  • 5+ years of experience in multi-layer PCB design (8+ layers) for mixed-signal systems.
  • Proficiency in Siemens Xpedition for schematic capture and layout.
  • Experience with high-speed digital interfaces including DDR, SerDes, and Ethernet (SGMII/RGMII).
  • Working knowledge of low-speed protocols such as I2C, SPI, and I3C.
  • Understanding of impedance-controlled routing and high-speed PCB design best practices.
  • Experience with PCB fabrication, assembly processes, and lab bring-up.
  • Must be a U.S. citizen, national, permanent resident, or lawfully admitted refugee/asylee per export control laws.

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