Substrate Technologist

What you'll do

• Lead RFSIP package substrate development, pathfinding technology, and roadmap definition.
• Partner with manufacturers, foundries, and OSATs to move substrate solutions from concept to high-volume manufacturing.
• Optimize new package substrate architectures based on performance, technical risk, cost, and availability.
• Drive the development of sophisticated package solutions, new materials, and industry specifications.
• Solve complex technical issues throughout the entire product development cycle.
• Manage the design, manufacturing, and reliability of Apple's package substrates.
• Oversee the integration of electronic packaging solutions for consumer products like iPhone, Mac, and Apple Watch.

What we're looking for

• BS degree and 10+ years of relevant industry experience.
• MS or Ph.D. and 5+ years of relevant industry experience (preferred).
• Proven fundamentals in the material, chemistry, or mechanical engineering field(s) (preferred).
• In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap (preferred).
• Hands-on experience in substrate manufacturing and technology development such as Cu plating, Lithography, Dielectric material, Laser via formation, and Solder resist (preferred).
• Familiarity with package assembly and integration process (preferred).
• Experience in Cadence Allegro platform tools and design review for manufacturing (DFM) (preferred).
• Exceptional technology development, project management, communication, and collaborative skills (preferred).