Packaging Substrate Engineer

Apple Inc

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Quick summary

Work type: On-site
Location: —
Salary: $184,700–$324,800 / yr
Posted: 15 days ago
Freshness: Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $212k

This role $255k

$145k most similar roles pay here $344k

This role pays more than 88% of similar roles. Most pay $177,250–$246,743 — the shaded band above. At the midpoint, this role pays about $255k versus about $212k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3513 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2730 roles with salary data.

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At a glance

TL;DR · Packaging Substrate Engineer

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As a Packaging Substrate Engineer within the Hardware Technology Packaging team, you will own and drive sophisticated package selection, new-generation structure development, and configuration optimization. You will be responsible for the design, technology, manufacturing, reliability, and roadmap of package substrates while collaborating with cross-functional teams to achieve optimal performance. Your daily work involves leading SoC package substrate technology pathfinding, defining roadmaps, and partnering with foundries and OSAT providers to move solutions from concept to high-volume manufacturing. You will solve technical issues throughout the product development cycle by managing material, chemistry, and mechanical engineering challenges. Key technical competencies include expertise in Cu plating, lithography, dielectric materials, via formation, solder resist, surface finish, and Cadence Allegro platform tools for design review for manufacturing. This role focuses on solving complex electronic packaging problems for internal and custom external components.

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