Senior Packaging Engineer

Microsoft

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
—
Salary
$119,800–$234,700 / yr
Posted
7 days ago
Freshness
Confirmed live today
Closes
Apr 17, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $183k
This role $177k
$106k $248k
below market most similar roles pay here above market

This role pays more than 51% of similar roles. Most pay $150,348–$216,250 — the blue band above. At the midpoint, this role pays about $177k versus about $183k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 694 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 651 roles with salary data.

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At a glance

TL;DR · Senior Packaging Engineer

The Senior Packaging Engineer joins the Quantum Systems organization to advance cutting-edge quantum technologies. In this role, you will develop and maintain robust assembly processes for quantum devices while documenting implementations across a global team. You will drive external packaging material vendors to leverage existing supply chains, evaluate suppliers as scaling partners, and implement test equipment for evaluating packaging solutions. The position requires expertise in industry-standard packaging materials, cryogenic materials, and microwave device packaging. You will work to adapt standard processes to the unique requirements of quantum hardware, solving complex technical problems in the quantum information technology space. Key competencies include managing outside vendors, communicating across multi-disciplinary teams, and leveraging AI tools for performance modeling, research gathering, and task automation to drive innovation and efficiency.

What you'll do

  • Develop and maintain robust assembly processes for quantum devices.
  • Document assembly processes and implementations across the global team.
  • Drive external vendors to deliver packaging solutions using existing supply chains.
  • Evaluate external packaging suppliers as potential scaling partners.
  • Develop and implement test equipment and processes for evaluating packaging solutions.
  • Support the development of advanced packaging technologies.

What we're looking for

  • Master's Degree in Electrical, Computer, or Mechanical Engineering and 3+ years technical engineering experience.
  • Bachelor's Degree in Electrical, Computer, or Mechanical Engineering and 5+ years technical engineering experience.
  • Equivalent technical engineering experience to the degrees listed above.
  • Ability to pass Microsoft Cloud Background Check and citizenship verification for export-controlled information.
  • Doctorate in Electrical, Computer, or Mechanical Engineering and 3+ years technical engineering experience (preferred).
  • Master's Degree in Electrical, Computer, or Mechanical Engineering and 6+ years technical engineering experience (preferred).
  • Bachelor's Degree in Electrical, Computer, or Mechanical Engineering and 8+ years technical engineering experience (preferred).
  • Experience with industry standard packaging materials, cryogenic materials, microwave device packaging, and vendor management (preferred).

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