below marketmost similar roles pay hereabove market
This role pays more than
53%
of similar roles. Most pay
$166,125–$237,700
— the blue band above.
At the midpoint, this role pays about
$204k
versus about
$202k
for comparable roles.
Based on 240 similar postings.
Employer
About Amd
AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors
Amd currently has
496 open roles
on FindRole.
Listed pay typically runs
$172,000–$258,000
across 496 roles with salary data.
The AI Automation Design Packaging Lead will lead the team responsible for developing and deploying next-generation packaging design automation and AI-driven workflows. The role focuses on accelerating the design of advanced heterogeneous integration technologies, specifically substrates, organic interposers, and bridge interconnects. Key responsibilities include deploying AI/ML methodologies to optimize auto-routing, component placement, and signal integrity while transitioning from manual practices to agentic and algorithmic design models. The candidate will utilize Python, Tcl, SKILL, or C++ alongside AI/ML frameworks like PyTorch or TensorFlow. Required expertise includes EDA packaging design tools such as Cadence APD/SIP, Siemens Xpedition, or Synopsys 3DIC/Compiler. This position solves complex design challenges by building closed-loop optimization systems for 2.5D and 3D packaging architectures, including chiplets and hybrid bonding.