SoC Physical Design Verification Engineer

Apple Inc

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Quick summary

Work type
On-site
Location
San Jose, CA
Salary
$184,700–$324,800 / yr
Posted
67 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $199k
This role $255k
$129k most similar roles pay here $346k

This role pays more than 99% of similar roles. Most pay $168,500–$229,650 — the shaded band above. At the midpoint, this role pays about $255k versus about $199k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3587 open roles on FindRole.

Listed pay typically runs $165,800–$277,600 across 2768 roles with salary data.

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At a glance

TL;DR · SoC Physical Design Verification Engineer

As a SoC Physical Design Verification Engineer within the Silicon Technologies group, you will join a critical team responsible for the physical verification of high-performance, power-efficient system-on-chip designs. Your daily responsibilities include performing various physical verification checks such as LVS, DRC, design-for-manufacturing, and lithography at both the chip and block levels. You will collaborate with CAD and Technology teams for flow bring up while working with implementation teams to drive signoff closure for tapeout. Additionally, you will manage schedules, support cross-functional engineering efforts, and work on padring, bump, and RDL design. Required skills include experience with DRC/LVS/ANT/HVDRC flows, ESD and macro placement guidelines, and mixed signal back-end verification. You will utilize industry standard tools like Mentor Calibre or Synopsys ICV and employ Perl, Python, or Tcl for automation and debugging.

What you'll do

  • Perform physical verification checks including LVS, DRC, DFM, and lithography at the chip and block levels.
  • Drive signoff closure for tapeout by working directly with the implementation team during the design cycle.
  • Collaborate with CAD and Technology teams to perform flow bring up and validation.
  • Manage project schedules and support cross-functional engineering efforts.
  • Design padring, bump, and RDL components in coordination with package and floorplan teams.
  • Develop scripts in Perl, Python, or Tcl to debug flow issues and automate verification checks.
  • Execute mixed-signal back-end verification checks including ESD and macro placement guidelines.

What we're looking for

  • Bachelor of Science degree and 10+ years of relevant industry experience.
  • Experience with physical verification flows such as DRC, LVS, ANT, and HVDRC signoff flows (preferred).
  • Experience with full-chip integration methodology (preferred).
  • Experience with ESD, macro placement design guidelines, and digital/analog mixed signal back-end verification (preferred).
  • Knowledge of ASIC physical design and physical verification checks for hierarchical designs (preferred).
  • Scripting skills in Perl, Python, or Tcl to debug flow issues and automate checks (preferred).
  • Experience with industry standard tools like Mentor Calibre or Synopsys ICV (preferred).
  • Tapeout experience with a track record of successful signoffs (preferred); layout design experience is a plus (preferred).

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